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Methods for detecting source monitoring units

A monitoring unit and detection source technology, applied in the direction of measuring devices, measuring electrical variables, instruments, etc., can solve problems such as unresponsive test stability, shorten the time to find test problems, prevent test problems, and improve test stability. Effect

Active Publication Date: 2021-09-03
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
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Problems solved by technology

[0005] The minimum detection current of the SMU can only detect 10 -9 A grade, but often measured 10 in the actual test - 11 A level; each self-test is only tested once for an order of magnitude, which cannot reflect the stability of the test; and this self-test is only self-tested in the internal circuit of the testing machine, which is different from the actual test for wafers

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  • Methods for detecting source monitoring units
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Embodiment Construction

[0030] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0031] As mentioned above in the background technology, the self-test program in the existing wafer acceptance tester still has many limitations for the detection of the source monitoring unit: the minimum detection current of the source monitoring unit can only detect 10- 9 Grade A, but often measured 10- in actual tests 11 A level; each self-test is only tested once for an order of magnitude, which cannot reflect the stability of the test; and this self-test is only self-tested in the internal circuit of the t...

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Abstract

The invention discloses a method for detecting a source monitoring unit, which is used for detecting multiple source monitoring units in a wafer acceptance tester, comprising: providing a wafer acceptance tester, selecting a plurality of source monitoring units; One source monitoring unit, connect the source monitoring unit and the two probes on the corresponding probe card; under the same condition, use each source monitoring unit to test the current on the probe or the voltage between the two probes multiple times ; Comparing and analyzing the currents or voltages measured by multiple source monitoring units, and judging whether the source monitoring units are abnormal. The present invention utilizes the probes on the probe card and the source monitoring unit in the wafer acceptance tester to form a conductive test circuit, and monitors multiple sources in the wafer acceptance tester under the condition of maximum closeness to the actual test. Units are tested, and by comparing the test results of multiple source monitoring units horizontally, abnormal source monitoring units can be found in time, so that test problems can be prevented in advance and the time to find test problems can be shortened.

Description

technical field [0001] The invention relates to the technical field of wafer acceptance testing, in particular to a method for detecting a source monitoring unit. Background technique [0002] Wafer acceptance test, namely WAT test (Wafer Acceptance Test), is usually an electrical test for various test structures on the wafer after all the wafer manufacturing processes are completed. Through wafer acceptance testing, we can discover problems in the semiconductor manufacturing process in time and help improve and adjust the manufacturing process. [0003] The WAT test system used for WAT testing is mainly composed of a wafer acceptance tester, a prober and a probe card. The wafer acceptance tester mainly applies a DC signal to control the movement of the prober tray and provides an operation interface; The probe machine mainly loads and unloads the wafer, precisely positions the wafer, and communicates with the test; the probe card mainly connects the test machine and the wa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R35/00
CPCG01R35/00
Inventor 韩斌
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP