A simulation evaluation method applied to component heat dissipation and its testing device

Abstract

The invention discloses a heat dissipation simulation evaluation method applied to components and a test device thereof, comprising: building a test device; testing corresponding parameters, and integrating the test data to establish a calculation model for actual design reference to establish a heat dissipation design through the method Model, the follow-up system simulation can be brought into the heat dissipation design model. By comparing the air volume flowing through the heat dissipation design model, it can be evaluated whether the heat dissipation structure meets the heat dissipation requirements. Using this tool can be used to test and evaluate the air volume required by other new models of GPUs that need to be introduced, and serve as a reference for the system simulation evaluation of new models. Bringing the established heat dissipation design model into the system not only saves a large number of grids required to establish a detailed model, but also saves calculation time, and through this comparison, it is verified that the simulation accuracy is greatly improved.

Description

technical field [0001] The invention relates to the field of heat dissipation detection of computer components, in particular to a simulation evaluation method for heat dissipation of components and a testing device thereof. Background technique [0002] With the development of new technologies such as cloud computing and big data, the bandwidth and capacity requirements for data storage are getting higher and higher, and the computing speed and computing volume of processors are also increasing, resulting in various components such as memory, hard disk, and GPU. The temperature of the electronic device is also soaring, and the heat dissipation of electronic devices has become a very burning problem, and the society's requirements for power consumption are getting higher and higher, and energy saving is a mainstream trend at present. The update iteration of the server is getting faster and faster. At present, the auxiliary means of heat dissipation design is to enhance the ...

AI Technical Summary

Problems solved by technology

According to the specifications provided by the manufacturer, the heat dissipation cannot be well evaluated, and the manufacturer did not provide a detailed simulation model

We can only simulate and compare and verify on different prototypes, which will not only damage the accuracy of simulation evaluation, but also hinder the progress of the entire project.

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