Wire clamp mechanism and wire bonding device
A wire clip and clip technology, applied in the field of wire clip mechanism and wire bonding machine, can solve the problems of low quality of welding wire and low connection reliability.
Pending Publication Date: 2019-02-01
广东阿达智能装备有限公司
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Problems solved by technology
With the rapid development of the semiconductor industry, the requirements for product quality and processing speed are getting higher and higher, and the general wire clamp mechanism cannot meet the processing requirements, resulting in lower quality of welding wire and lower reliability of connection.
Method used
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Embodiment Construction
[0023] Such as Figure 1 to Figure 4 As shown, in one embodiment, a wire clip mechanism 10 is provided, including a support member 11, an elastic member 12, and a fixed clip 13 and a swing clip 14 that are oppositely arranged. The support member 11 is supported on the fixed clip 13 and the swing clip. 14, so that under abnormal conditions, the active end of the swing clamp 14 can swing back and forth with the vertical line of the support 11 as the axis of rotation relative to the fixed clamp 13 under the action of the drive assembly 15, and at the same time drive the When the driven end of the swing clip 14 holding the welding wire 20 is continuously opened and closed with the driven end of the fixed clip 13, one end of the elastic member 12 is connected with the fixed clip 13, and the other end of the elastic member 12 is connected with the fixed clip 13. The swing clip 14 is connected, and the elastic member 12 is located on the side of the support 11 away from the active en...
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The invention relates to a wire clamp mechanism and a wire bonding device. An included support member is supported between a fixed clamp and a swinging clamp, so that the driving end of the swinging clamp in the abnormal state can swing to and fro relative to the fixed clamp by taking the perpendicular bisector of the support member as the rotation axis under effect of a driving assembly, the driven end, for clamping a bonding wire, of the swinging clamp is driven to connect with and disconnect from the driven end of the fixed clamp constantly, the two ends of an elastic member are connected with the fixed clamp and the swinging clamp respectively, the elastic member is positioned in the side, far from the driving end of the swinging clamp, of the support member and close to the support member, and thus, the driving end of the swinging clamp in the normal state can keep contact with the driven end of the fixed clamp always. The elastic member is arranged close to the support member, itis ensured that the swinging clamp keeps contact with the driven end of the fixed clamp always, the deformation variation of the elastic member fluctuates narrowly in the rotation process of the swinging clamp, the response speed and the control precision of a clamping force are improved, and the wire bonding quality and the connection reliability are both improved.
Description
technical field [0001] The invention relates to the field of semiconductor processing, in particular to a wire clamp mechanism and a wire bonding machine. Background technique [0002] Wire bonding machines primarily use metal wires to connect chip pads to package pins. As an important part of the wire bonding machine, the wire clamp mechanism is mainly used to clamp the welding wire and send it to the bonding position, so that the welding wire is bonded on the electrode and the chip. With the rapid development of the semiconductor industry, the requirements for product quality and processing speed are getting higher and higher, and the general wire clamp mechanism cannot meet the processing requirements, resulting in lower quality of welding wire and lower reliability of connection. Contents of the invention [0003] Based on this, it is necessary to provide a wire clamp mechanism and a wire bonding machine to improve the response speed of the wire clamp mechanism and th...
Claims
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CPCH01L24/78H01L2224/78981H01L2224/78
Inventor 贺云波王波刘青山刘凤玲陈桪
Owner 广东阿达智能装备有限公司