Unlock instant, AI-driven research and patent intelligence for your innovation.

A preparation method of composite conductive ink for printing bending-resistant printed circuit

A composite conductive and printed circuit technology, which is applied in the field of composite conductive ink preparation, can solve the problem of silver conductive ink not being resistant to bending, and achieve the effect of excellent bending resistance.

Active Publication Date: 2021-09-24
深圳烯材科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the existing silver conductive ink is not resistant to bending, the object of the present invention is to provide a method for preparing a composite conductive ink for printing a bending-resistant printed circuit, using two-dimensional nanomaterials with high flexibility and strength as Buffer structure, inhibiting the cutting effect of metal silver particles on the resin matrix under bending conditions, thereby improving the bending resistance of printed circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A preparation method of composite conductive ink for printing bending-resistant printed circuit
  • A preparation method of composite conductive ink for printing bending-resistant printed circuit
  • A preparation method of composite conductive ink for printing bending-resistant printed circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] In this embodiment, 1 kg of nano-silver powder (average particle size is 800 nm) and 3 g of graphene powder (average number of layers is 3 layers, average sheet diameter is 2 μm) are mixed uniformly by mechanical stirring, and then added into a stainless steel container with a volume of 1 L. Add 2.5kg stainless steel grinding balls to the high-temperature ball mill tank, vacuumize after sealing, and then flush high-pressure nitrogen until the pressure in the tank is 1.5 atm before sealing. Use the built-in heating device of the ball milling tank to heat the tank body to 450°C, and then start the ball milling; the high temperature ball milling treatment time is 2 hours. After 2 hours, stop the electric heating, and continue the ball milling treatment for 1 hour before stopping. After the ball milling, use cold water spray to cool the ball mill tank to room temperature quickly, open the ball mill tank after releasing the pressure, separate the balls and powder by vibratin...

Embodiment 2

[0033] In this embodiment, 1 kg of nano-silver powder (average particle size is 800 nm) and 5 g of vanadium oxide nanosheet powder (average number of layers is 3 layers, average sheet diameter is 2 μm) are mixed uniformly by mechanical stirring, and then added to a stainless steel plate with a volume of 1 L. Add 2.5kg of stainless steel grinding balls to a high-temperature ball milling tank made of high-temperature materials, vacuumize after sealing, and then flush high-pressure nitrogen until the pressure in the tank is 1.5 atm before sealing. Use the built-in heating device of the ball milling tank to heat the tank body to 450°C, and then start the ball milling; the high temperature ball milling treatment time is 2 hours. After 2 hours, stop the electric heating, and continue the ball milling treatment for 1 hour before stopping. After the ball milling, use cold water spray to cool the ball mill tank to room temperature quickly, open the ball mill tank after releasing the pres...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
thicknessaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of printed electronic materials, in particular to a method for preparing a composite conductive ink for printing a bending-resistant printed circuit. The printed circuit manufactured by using the composite conductive ink can withstand repeated bending under a long-term heavy load without A drop in electrical conductivity occurs. Metal silver and two-dimensional nanomaterial composite conductive agent prepared by high temperature ball milling process are used as conductive filler, compounded with resin and solvent, and then ground. The printed circuit made of this composite conductive ink can withstand repeated bending under heavy load for a long time without the decline of conductive performance. Based on the composite conductive filler technology, using different resins and solvents, conductive inks suitable for different printing processes such as screen printing, gravure printing, and inkjet printing can be made. These conductive inks have the characteristics of high flexibility and bending resistance, and are especially suitable for In the manufacture of printed circuits for wearable electronic devices.

Description

technical field [0001] The invention relates to the field of printed electronic materials, in particular to a method for preparing a composite conductive ink for printing a bending-resistant printed circuit. The printed circuit manufactured by using the composite conductive ink can withstand repeated bending under a long-term heavy load without A drop in electrical conductivity occurs. Background technique [0002] Conductive ink is a key material in the field of printed electronics. Among them, conductive ink made of metallic silver is currently the most commonly used material for the preparation of low-resistance printed circuits, and has the advantages of low resistance and oxidation resistance. However, the poor bending resistance of printed wires is an important technical problem in the field of printed electronics. With the development of wearable electronic devices and the emergence of the need to integrate electronic devices on the surface of clothing fabrics, impro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/52C09D11/14C09D11/104C09D11/107C09D11/103C09D11/102C09D11/106C09D11/03
CPCC09D11/03C09D11/102C09D11/103C09D11/104C09D11/106C09D11/107C09D11/14C09D11/52
Inventor 刘永生
Owner 深圳烯材科技有限公司