Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave

A technology for bonding films and conductive adhesives, used in conductive adhesives, magnetic field/electric field shielding, adhesive types, etc. issues of sex

Active Publication Date: 2008-02-06
TOYO INK SC HOLD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional adhesive layers do not have sufficient bending resistance and sufficient heat resistance, and a

Method used

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  • Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave
  • Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave
  • Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0234] "Example 1"

[0235] With respect to 333 parts of polyurethane polyurea resin solution (A-1), 20 parts of bisphenol A type epoxy resin ("Epco Eto 828" manufactured by Jupon Epoxiejin, epoxy equivalent = 189g / eq) was added to obtain an adhesive Resin composition. 180 parts of flaky silver powder (“AgXF-301” manufactured by Futian Metal Foil Industry) was added to 353 parts of the adhesive resin composition, and stirred and mixed to obtain a curable conductive adhesive composition.

[0236] Next, a 125μm thick polyethylene terephthalate film ("SA-125PET" manufactured by Unitec) was used as a reinforcing film, and a micro-gravure coater was used to coat a heat-resistant micro-adhesive ("BPS5525" manufactured by Toyo Ink Manufacturing Co., Ltd.), the thickness was set to 2 μm (dry film thickness), and dried to form a micro-adhesive layer. A polyphenylene sulfide film with a thickness of 9 μm ("Torayna 3030" manufactured by Toray) was laminated on the micro-adhesive layer as a b...

Example Embodiment

[0238] "Example 2"

[0239] With respect to 333 parts of polyurethane polyurea resin solution (A-2), 10 parts of bisphenol A type epoxy resin ("Epco Eto 828" manufactured by JP E Pemex 828", epoxy equivalent = 189 g / eq), 0.7 parts of micro Dicyandiamide ("Epure DICY7" manufactured by Jippen Essien) and 0.1 part of an imidazole-based curing accelerator ("PN-40" manufactured by Ajinomoto Fyntec) were crushed to obtain an adhesive resin composition. 166 parts of flaky silver powder (“AgXF-301” manufactured by Futian Metal Foil Industry) was added to 343.8 parts of the adhesive resin composition, and stirred and mixed to obtain a curable conductive adhesive composition.

[0240] Next, a 125μm thick polyethylene terephthalate film ("SA-125PET" manufactured by Unitec) was used as a reinforcing film, and a micro-gravure coater was used to coat a heat-resistant micro-adhesive ("BPS5525" manufactured by Toyo Ink Manufacturing Co., Ltd.), the thickness was set to 2 μm (dry film thickness), ...

Example Embodiment

[0242] "Example 3-11"

[0243] Except that the types and amounts of polyurethane polyurea resin solutions, epoxy resins and flaky silver powder shown in Table 1 and Table 2 were used, the operation of Example 1 was repeated to prepare various curable conductive adhesive compositions to prepare Electromagnetic wave shielding adhesive film.

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Abstract

An electromagnetic-wave-shielding adhesive film which comprises a base film and a curable conductive adhesive layer (I), wherein the curable conductive adhesive layer (I) comprises: a polyurethane-polyurea resin (A) prepared by reacting a polyamino compound (e) with a urethane prepolymer (d) having an isocyanate group at an end and obtained by reacting a carboxylated diol compound (a), a polyol (b) which has a number-average molecular weight of 500-8,000 and is not a carboxylated diol compound, and an organic diisocyanate (c); an epoxy resin (B) having two or more epoxy groups; and a conductive filler.

Description

technical field [0001] The present invention relates to an electromagnetic wave shielding adhesive film, a preparation method thereof, and an electromagnetic wave shielding method of an adherend. The electromagnetic wave-shielding adhesive film of the present invention is bonded to a flexible printed wiring board subjected to repeated bending, and is suitable for use in shielding electromagnetic interference generated by electronic circuits. Background technique [0002] Flexible printed circuit boards are bendable, and respond to the further performance and miniaturization requirements of OA equipment, communication equipment, mobile phones, etc. in recent years, and are often used to assemble electronic circuits into narrow and complex structures. With the miniaturization and frequency increase of such electronic circuits, countermeasures against unnecessary electromagnetic noise generated thereby are becoming more and more important. Therefore, conventionally, an electro...

Claims

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Application Information

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IPC IPC(8): H05K9/00B32B27/00C08L63/00C08L75/04C09J9/02C09J163/00C09J175/04C09J7/35
CPCC09J9/02B32B27/40B32B2457/08C08G18/12C08G18/0823H05K9/0088B32B2307/306B32B27/20C08G18/4045C09J2475/00H01L23/552B32B7/12C09J2463/00H01L2924/0002B32B27/38B32B2307/554C08G18/6541B32B27/08C08K3/08C09J7/0203B32B2307/51C09J2463/006C09J7/35C08G18/3225H01L2924/00B32B27/00C08L75/04C08L63/00
Inventor 小林英宣西山祐司桑原章史松泽孝洋梅泽三雄坂井祥平
Owner TOYO INK SC HOLD CO LTD
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