164results about How to "Easy lamination" patented technology

A wrap around, self laminating wristband comprises a substantially transparent laminate strap with an imaging area for receiving printed information and one or more layers of adhesive adjacent the imaging area so that as the strap is wrapped around itself to overlie the imaging area it laminates it. Alternate embodiments provide for a snap closure to secure the wristband instead of adhesive, forming the imaging area with a coating of a thermally sensitive or active print material, adding one or more labels for common use with the wristband, forming the wristband in a page of multiple wristbands or with labels or separately, forming the wristband as part of a printer processible business form, and providing the wristband forms either with or without labels in a continuous fan fold or roll format.

Disclosed is a method for manufacturing a separator for an electrochemical device. The method contributes to formation of a separator with good bondability to electrodes and prevents inorganic particles from detaching during an assembling process of an electrochemical device.

Nonwoven wet-lay flame barrier of the invention comprises a blend of water dispersible fibers, that are inherently fire resistant and nonshrinking to direct flame, along with water dispersible fibers extruded from polymers made with halogenated monomers and optionally including fiberglass and wood pulp, being together thermally bonded with a binder resin in a wet-lay manufacturing process to provide a relatively thin, but dense, durable flame barrier with excellent tensile, and durability properties in the end use application. The wet-lay flame barrier of this invention also allows for the manufacture of open flame resistant composite articles, while also permitting the continued use of conventional non-flame retardant dress cover fabrics, conventional non-flame retardant fiberfills and conventional non-flame retardant polyurethane foams.

An electromagnetic-wave-shielding adhesive film which comprises a base film and a curable conductive adhesive layer (I), wherein the curable conductive adhesive layer (I) comprises: a polyurethane-polyurea resin (A) prepared by reacting a polyamino compound (e) with a urethane prepolymer (d) having an isocyanate group at an end and obtained by reacting a carboxylated diol compound (a), a polyol (b) which has a number-average molecular weight of 500-8,000 and is not a carboxylated diol compound, and an organic diisocyanate (c); an epoxy resin (B) having two or more epoxy groups; and a conductive filler.

The invention discloses packaging technology for a crystal silicon solar-energy photovoltaic battery unit, which comprises the following steps of front welding, back concatenation, laminated laying, component lamination, battery trimming, framing, junction box welding, packaging testing and warehousing, and has the advantages that the packaging technology removes bubbles by lamination and vacuum-pumping so as to have good lamination effect, performs fractionated lamination so as to ensure that the relative position of a component string, glass and the like is stable and the lamination quality is high, and has short curing time and high production efficiency.

To provide a thin film circuit device in which a three-dimensional circuit structure is realized, a thin film circuit device is formed of a first thin film circuit layer and a second thin film circuit layer laminated to each other. The first thin film circuit layer contains a first thin film circuit provided between an underlayer and a protective layer and a lower connection electrode connected to the first thin film circuit and exposed at a part of the bottom surface of the underlayer. The second thin film circuit layer contains a second thin film circuit provided between an underlayer and a protective layer, an upper connection electrode connected to the second thin film circuit and exposed at a part of the top surface of the protective layer, and a lower connection electrode connected to the second thin film circuit and exposed at a part of the bottom surface of the underlayer. The first and the second thin film circuits are bonded to each other so that the lower connection electrode of the first thin film circuit layer is electrically connected to the upper electrode of the second thin film circuit layer.

The present invention relates to an integrated device (10) comprising at least one active organic element (14, 24, 26), a substrate supporting the at least one active organic element, a prefabricated thin battery (20) coupled to the at least one active organic element, and an encapsulation for sealing the integrated device, wherein one of the substrate and the encapsulation is formed by the prefabricated thin battery. This structure allows for a thin integrated device. The present invention also relates to a method for the manufacturing of such an integrated device.

Fiber oriented sails made of woven panels of scrim type weave wherein warp yarns in the panels follow primary load paths in a sail and a method for making woven panels and sails.

Provided are an optimized tool apparatus and methods for dry transfer printing of semiconductor elements with high yield and good placement accuracy. The tool apparatus comprises a vacuum coupled fast peel apparatus that provides high pickup yield of the semiconductor elements. In an aspect, this vacuum coupled apparatus provides high pickup rates during pickup of the semiconductor elements from a donor/source wafer. Provided is a tool apparatus for dry transfer printing with a reinforced composite stamp having a thin glass-backing. The tool apparatus also comprises a pressure regulated micro-chamber which provides precise control of a composite stamp lamination and de-lamination. In an aspect, the micro-chamber has an internal cavity volume that is variably controlled, thereby providing precise control of the force on the stamp, and corresponding separation velocity, and improved semiconductor element pick-up and/or placement.

An optical compensatory sheet comprises a transparent support and an optically anisotropic layer. The optically anisotropic layer is formed from liquid crystal molecules. Three principal refractive indices of the optically anisotropic layer are different from each other.

A carpet has a layer of tufting supported on a primary backing layer. A breathable membrane is disposed along an interface between the primary backing layer and a secondary backing layer. A breathable membrane is disposed along an interface between the tufting layer and the backing layer, and adhesively secures the layer of tufting to the backing layer. The breathable membrane is permeable to water vapor but impervious to liquid water, while both the tufting layer and the backing layer are permeable to water vapor. In an alternative embodiment of the invention, a laminated barrier which includes the membrane, may be made of fibers, yarns, cross-laid scrim, or plastic netting, and the breathable membrane may be protected from abrasion with a floor by means of an apertured film laminated to the membrane.

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the cooper foil, resin film, and the adhesive layer, and filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

There is provided a nitride semiconductor light emitting device capable of inhibiting output deterioration of light emission caused by quality deterioration of a nitride semiconductor layer due to lattice-mismatching between a substrate and the nitride semiconductor layer, and utilizing light traveling to the substrate efficiently, while forming a light emitting device of a vertical type which has one electrode on a back surface of the substrate by using the substrate made of SiC. A light reflecting layer (2) which is formed by laminating low refractive index layers (21) and high refractive index layers (22) having different refractive indices alternately is directly provided on the SiC substrate (1), and a semiconductor lamination portion (5) which is formed by laminating nitride semiconductor layers so as to form at least a light emitting layer forming portion (3) is provided on the light reflecting layer (2). An upper electrode (7) is provided on an upper surface side of the semiconductor lamination portion (5), and a lower electrode (8) is provided on a back surface of the SiC substrate (1).

A generator includes a shaft and rotor body defining poles and a winding positioned around the shaft on the rotor body. A rotor pole crossover is aligned to the shaft and connects ends of the winding between adjacent poles. The rotor pole crossover includes a body member having a curved medial section and opposing legs extending outwardly from the curved medial section that connect to the ends of the winding. The curved medial section has at least one slot formed therein to add flexibility to the rotor pole crossover.

Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

An object of the invention is to provide a light reflective film which can prevent moire fringes from occurring. A rough face in which a plurality of rows of pyramidal convex portions that are linearly continuous are adjacently formed in parallel with one another is formed on one face of a die film. The rows of convex portions that are linearly continuous are inclined at a predetermined angle with respect to an edge of the die film. An optical film is produced by transferring the die film. A light reflective film is produced by vapor-depositing a light reflection film on the optical film. In a liquid crystal display panel having the light reflective film, the pitch of occurring moire fringes becomes so small that the moire fringes cannot be visually seen, and moire fringes can be prevented from occurring.

The invention provides an electrophotographic laminated film and a method for producing the electrophotographic laminated film. The electrophotographic laminated film comprises a substrate and at least one of a coating layer and a function control means provided on a surface of the substrate. The uppermost layer of the coating layer has a surface resistance in a range of 1.0×10⁸ to 1.0×10¹³ Ω/□. The surface of the substrate preferably comprises at least one of a polycarbonate resin and a polyallylate resin. At least one of the coating layer and the function control means is preferably formed by providing a coating liquid. Further, a solvent contained in the coating liquid is preferably permits at least one of the coating layer and function control means to be formed while dissolving the surface of the substrate.

A stacked device manufacturing method including a kerf forming step of forming a kerf on the front side of each of plural wafers along each street, the kerf having a depth corresponding to a predetermined finished thickness of each wafer, a first stacking step of stacking a first one of the wafers and a second one of the wafers in such a manner that the front side of the second wafer is opposed to the front side of the first wafer and that the electrodes of the second wafer are respectively bonded to the electrodes of the first wafer, a first back grinding step of grinding the back side of the second wafer to expose each kerf of the second wafer to the back side of the second wafer, a second stacking step of stacking a third one of the wafers to the second wafer in such a manner that the front side of the third wafer is opposed to the back side of the second wafer and that the electrodes of the third wafer are respectively bonded to the electrodes of the second wafer, and a second back grinding step of grinding the back side of the third wafer to expose each kerf of the third wafer to the back side of the third wafer.

The cellulose acylate film has a lower degree of curling in water and is excellent in its processability, as a film suitable for manufacturing a polarizing plate. At least one portion of roll drying parts of a film manufacturing apparatus has a high-temperature drying zone where drying air having a temperature of 115° C. or more is blown on the film to dry thereof. In the high-temperature drying zone, the drying air is supplied by any of the methods as follows: (1) the drying air is blown on a substrate side of the film; (2) the drying air is blown on an air side of the film such that the drying air velocity becomes 3 m/s or less; and (3) the drying air is blown on both sides of the film. The film thus manufactured is provided with characteristics that a curvature radius of curling when the film is dipped in water at 25° C. is 25 mm or more and a ratio between a plasticizer content of the substrate side and a plasticizer content of the air side when the film is divided into two portions along the thickness direction thereof is from 1.2 to 2.0.

Provided is a gas-barrier multilayer film which is superior in gas-barrier properties and interlayer adhesion property, and which exhibits less deterioration in gas-barrier properties and is resistant to interlayer delamination even in prolonged exposure to a high-temperature and high-humidity environment or after a retort treatment. A gas-barrier multilayer film, wherein (A) a first inorganic thin film layer, (C) a gas-barrier resin composition layer, and (D) a second inorganic thin film layer are stacked in this order with or without intervention of other layers on at least one surface of a plastic film, the gas-barrier resin composition layer (C) is formed from a gas-barrier resin composition comprising (a) a gas-barrier resin including an ethylene-vinyl alcohol-based copolymer, (b) an inorganic layered compound, and (c) at least one additive selected from coupling agents and crosslinking agents, and the content of the inorganic layered compound (b) in the gas-barrier resin composition is from 0.1% by mass to 20% by mass based on 100% by mass in total of the gas-barrier resin (a), the inorganic layered compound (b), and the additive (c).

An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness R_a and a reflection density RD, the product R_a times RD being 0.5 to 1.6 μm. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an R_a of at most 0.45 μm and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 μm. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

An LED multi-chip bonding die (1) comprises a packaging enclosure, a plurality of LED chips and a packaging cover, wherein the chips are arranged in one line from top to bottom on the emitting platform. Large area electrodes are equipped on the packaging enclosure and the packaging cover is made of transparent silicon gel so that the bonding die can emit larger light energy and higher luminance via the packaging cover while the heat produced by the chips can be quickly dissipated by the electrodes. A light strip (20) equipped with the bonding die comprises a plurality of bonding die sections and circuit board (2) and each bonding die section (1) comprises four LED multi-chip bonding dies (1) and a current-limiting resistor in series circuit. Each series circuit is connected in parallel and circuit board (2) is printed circuit board which can provide a optimal heat-dissipating structure for chips of bonding die.