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Cooling device and method for big data integrated machine

A heat dissipation device and all-in-one technology, which is applied in cooling/ventilation/heating transformation, shells with display/control units, instruments, etc., can solve the problems of difficult operation of equipment, poor heat dissipation effect, overheating of equipment, etc., and achieve improvement The effect of equipment working efficiency, high heat exchange effect and long service life of equipment

Inactive Publication Date: 2019-02-12
ZHENGZHOU LINKINALL INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Big data refers to a collection of data that cannot be captured, managed, and processed by conventional software tools within a certain period of time. It is a massive, high-growth rate that requires a new processing model to have stronger decision-making power, insight and discovery, and process optimization capabilities. And diverse information assets, which require a large amount of memory for information storage, but the memory will generate heat when it is working, which will cause the device to overheat, so it needs to be cooled. The main problem of common heat dissipation devices is the heat dissipation effect Poor, difficult equipment operation, poor security, etc., so it is necessary to invent a new type of equipment to solve the above problems

Method used

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  • Cooling device and method for big data integrated machine
  • Cooling device and method for big data integrated machine
  • Cooling device and method for big data integrated machine

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Embodiment Construction

[0026] Below in conjunction with embodiment and accompanying drawing, the present invention will be further described:

[0027] Such as Figure 1-Figure 7 As shown, a heat dissipation device for a big data all-in-one machine includes an all-in-one chassis 6, a radiator 1, a console 4, and a circulating cold source 5. The radiator 1 is arranged on the outside of the all-in-one chassis 6, and the radiator 1 One side is provided with a heat conduction plate 9, one side of the heat conduction plate 9 is provided with a waterproof sealed box 8, one side of the heat conduction plate 9 is provided with the temperature sensor 7, and the bottom of the waterproof sealed box 8 is provided with a A pressure pump 14, the flow velocity detector 13 is arranged on one side of the pressure pump 14, the liquid level sensor 12 is arranged above the flow velocity detector 13, and a circulation pipeline is arranged above the pressure pump 14 11. The circulation pipeline 11 is provided with a heat...

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PUM

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Abstract

The invention discloses a cooling device and method for a big data integrated machine. The cooling device comprises an integrated case, a radiator, a console, and a circulating cold source; the radiator is arranged outside the integrated case; a heat transfer plate is arranged on one side of the radiator; a waterproof sealed box is arranged on one side of the heat transfer plate; a temperature sensor is arranged on one side of the heat transfer plate; a pressure pump is arranged at the bottom of the waterproof sealed box; a flow speed detector is arranged on one side of the pressure pump; a liquid level sensor is arranged above the flow speed detector; a circulating line is arranged above the pressure pump; a radiating sprayer is arranged on the circulating line; a seal ring is arranged onone side of the radiator; a connection pipe is arranged on one side of the seal ring; the circulating cold source is arranged on one side of the integrated case. The cooling device has the advantagesof high heat exchange efficiency, long life, high practicality, higher working efficiency, and lower cost.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and method for a big data all-in-one machine. Background technique [0002] Big data refers to a collection of data that cannot be captured, managed, and processed by conventional software tools within a certain period of time. It is a massive, high-growth rate that requires a new processing model to have stronger decision-making power, insight and discovery, and process optimization capabilities. And diverse information assets, which require a large amount of memory for information storage, but the memory will generate heat when it is working, which will cause the device to overheat, so it needs to be cooled. The main problem of common heat dissipation devices is the heat dissipation effect Poor, difficult equipment operation, poor security, etc., so it is necessary to invent a new type of equipment to solve the above problems. Conten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/00G08B21/24
CPCH05K7/20709G08B21/24H05K5/0017H05K7/20718H05K7/20763H05K7/20836
Inventor 佘维宋伟刘炜师恩洁陈华侯耀峰杨彦文杨斌
Owner ZHENGZHOU LINKINALL INFORMATION TECH CO LTD