Composite substrate, shell and manufacturing method of composite substrate

Abstract

An embodiment of the invention discloses a composite substrate, a shell and a manufacturing method of the composite substrate. The composite substrate comprises a first outer plate, a second out plate, a middle layer and at least one pair of antennae, the middle layer is arranged between the first outer plate and the second out plate, and the antennae are arranged between the first outer plate andthe middle layer or between the second outer layer and the middle layer. When the composite substrate is stacked, the antennae serve as components to be placed into sandwich layers, joints of feedingpoints are milled out by an etching method, the antennae can be provided with iron parts or thin parts made of other materials, and the area of the substrate is larger than that of an antenna area, so that the placing number can meet the size and the number of all antennae. The shell is prepared from the composite substrate, the antennae are hidden, and original space for placing other parts in electronic devices can be used for placing other parts, so that narrow-bezel design of the electronic devices is achieved.

Description

technical field [0001] The invention relates to the technical field of plates, in particular to a composite substrate, a shell made of the composite substrate and a manufacturing method of the composite substrate. Background technique [0002] At present, many notebook computers and tablet computer products seek to diversify the texture and function, resulting in fewer and fewer places where notebook antennas can be placed; and in order to maximize the radiation field of the antenna, a large antenna headroom is required to satisfy users. wireless usage requirements. This makes the antenna take up a lot of space, making it difficult for notebook computers and tablet computers to achieve thinner and thinner bezel designs. [0003] For the A / C / D side (A, C, and D refer to the four sides of the notebook computer respectively, when the notebook computer is in the buckled state, the side facing upward is the side A, the side where the buttons are set is the side C, and the bottom...

AI Technical Summary

Problems solved by technology

[0005] Using the above method requires injection molding process, the yield rate of the design process is low, and the cost is very high

And it needs to give way to a lot of space, resulting in complex structure of the casing, difficulty in making molds, and prone to problems in appearance

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