Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rigid circuit board and manufacturing method thereof

A technology of rigid circuit board and manufacturing method, which is applied in the direction of printed circuit parts, circuit bendable/stretchable parts, etc., can solve the problems of limited space, difficulty in mounting electronic components, etc., and solve the problem of limited installation space. The effect of limiting and facilitating the placement of electronic components

Active Publication Date: 2021-10-12
SHENZHEN AJAZZ TONGCHUANG ELECTRONICS TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Rigid circuit boards generally consist of a base material and copper foil attached to the base material. Although the base material of a rigid circuit board is relatively hard, it has certain bending properties, and the copper foil also has certain tensile properties. Therefore, the circuit The board substrate supports bending to a certain extent. However, directly bending the circuit board substrate can easily cause the original flat circuit board substrate to become a curved plane as a whole, and it is difficult to mount electronic components on the curved plane.
The product may be due to limited space. In the prior art, multiple rigid circuit boards are used to integrate electronic components separately to solve the problem of installation space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rigid circuit board and manufacturing method thereof
  • Rigid circuit board and manufacturing method thereof
  • Rigid circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. It can be understood that the drawings are provided for reference and description only, and are not intended to limit the present invention. The connection relationship shown in the drawings is only for the convenience of clear description, and does not limit the connection mode.

[0033] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component, or there may be intervening ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a rigid circuit board, including a circuit board substrate and a first electronic component. The circuit board substrate includes at least one bending area and fixing areas located on both sides of the bending area. The first electronic component is attached to Installed in the fixing area, an opening is provided in the bending area, and the opening basically extends along the axial direction of the bending area. The invention also provides a manufacturing method of the rigid circuit board. The invention can bend the rigid circuit board to solve the problem of limited installation space, and the circuit board substrate at the non-bent position remains flat, which is convenient for mounting electronic components.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a rigid circuit board and a manufacturing method thereof. Background technique [0002] Rigid circuit boards are circuit boards with high rigidity, which cannot be replaced by flexible circuit boards in some fields. Rigid circuit boards generally consist of a base material and copper foil attached to the base material. Although the base material of a rigid circuit board is relatively hard, it has certain bending properties, and the copper foil also has certain tensile properties. Therefore, the circuit The board substrate supports bending to a certain extent. However, directly bending the circuit board substrate can easily cause the original flat circuit board substrate to become a curved plane as a whole, and the curved plane makes it difficult to mount electronic components. The product may be due to limited space. In the prior art, multiple rigid circuit boards are use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0278
Inventor 林峰吴灿
Owner SHENZHEN AJAZZ TONGCHUANG ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com