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Novel flexible circuit board double-sided hollow line manufacturing method

A flexible circuit board and circuit production technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of incomplete circuit graphics in the hollow area, unreliable covering film pressure, and many operating procedures, etc., to achieve stable circuit graphics, Avoid incomplete lines and reduce the effect of operating procedures

Active Publication Date: 2019-02-22
信丰迅捷兴电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board or FPC, with high wiring density and light weight. , Thin thickness; With the rapid development of electronics, light weight, small size, and ultra-thin are the main types of electronics. Flexible circuit boards have become the first choice for designers. They are mainly used in mobile phones, notebook computers, PDAs, digital cameras, Many products such as LCM; traditional printed circuit boards use liquid medicine to etch away the copper exposed after development to form circuit patterns. , so that the circuit graphics in the hollowed out area are incomplete, and the covering film is not pressed tightly and bubbles appear. This processing method has many operating procedures, low efficiency, high cost, and the quality of the produced circuit boards is low.

Method used

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  • Novel flexible circuit board double-sided hollow line manufacturing method
  • Novel flexible circuit board double-sided hollow line manufacturing method
  • Novel flexible circuit board double-sided hollow line manufacturing method

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Embodiment Construction

[0027] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0028] A new type of flexible circuit board double-sided hollow circuit manufacturing method, such as Figure 1 to Figure 5 As shown, the following steps are included:

[0029] Sp1, such as figure 2 As shown, the copper foil 1 is cut and cut; specifically, the cutting process cuts the copper foil 1 to the processing size required by the design according to the user's own needs, and the copper foil 1 is a rolled copper foil.

[0030] Sp2, such as figure 2 As shown, a layer of protective film 3 is pasted on a copper surface of copper foil 1; specifically, copper foil 1 has two copper surfaces, and a copper surface in the present invention refers to a board surface of copper foil 1 , and the corresponding other copper surface refers to another board surface; since the production of double-sided ho...

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PUM

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Abstract

The invention discloses a novel flexible circuit board double-sided hollow line manufacturing method, and belongs to the technical field of printed circuits. The method includes: cutting a material; performing copper foil cleaning; performing laser cutting; reserving connecting lines between circuits to form a connecting bridge; pasting and pressing a first covering film; removing the connection bridge; performing secondary cleaning on a copper foil; and pasting a second covering film to form a double-sided hollow circuit board. A circuit pattern is cut by the UV laser technology to replace the traditional line etching processing method, which avoids line filming, exposure, development and etching processes, reduces the operation process, and improves the efficiency; the situation that a circuit in the hollow region is incomplete due to residual liquid chemical and bubbles exist due to incomplete pressing of the film in the traditional line etching process can be avoided; a plurality of connecting lines distributed at equal intervals are arranged between any two adjacent lines, the reserved connection lines can support the circuit pattern, which can ensure that the circuit patternis more stable during the subsequent lamination of the covering film, thereby further improving the quality of the product.

Description

technical field [0001] The invention relates to the technical field of printed circuits, and more specifically, to a method for manufacturing a double-sided hollow circuit of a novel flexible circuit board. Background technique [0002] Flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board or FPC, with high wiring density and light weight. , Thin thickness; With the rapid development of electronics, light weight, small size, and ultra-thin are the main types of electronics. Flexible circuit boards have become the first choice for designers. They are mainly used in mobile phones, notebook computers, PDAs, digital cameras, Many products such as LCM; traditional printed circuit boards use liquid medicine to etch away the copper exposed after development to form circuit patterns. , so that the circuit pattern in the hollowed out area is incomplete, and the cover film is not pressed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02
CPCH05K3/027H05K2203/107
Inventor 杜林峰陈强易浩陈定成
Owner 信丰迅捷兴电路科技有限公司