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Adjustment method of slurry concentration

A concentration adjustment and polishing liquid technology, which is applied in chemical instruments and methods, grinding/polishing equipment, and other chemical processes, can solve problems such as excessive grinding, not being ground to a predetermined level, and waste of polishing liquid, etc., to prevent wasteful effect

Active Publication Date: 2022-06-03
DISCO CORP
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Problems solved by technology

[0005] However, when the concentration of the polishing liquid in the above-mentioned container is not properly adjusted, the polishing liquid is supplied to the surface of the workpiece being ground, so that the surface of the workpiece is not ground to a predetermined degree, or is too large compared to the predetermined degree. Poor processing such as grinding
In such a case, it is necessary to pump out all the grinding liquid in the pipe, which will waste the grinding liquid

Method used

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  • Adjustment method of slurry concentration
  • Adjustment method of slurry concentration
  • Adjustment method of slurry concentration

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Embodiment Construction

[0014] figure 1 The shown grinding liquid generation mechanism 1 has: a container 2, which stores the grinding liquid; a pure water supply part 3, which provides pure water W to the container 2; a concentrated grinding liquid supply part 4, which provides the concentrated grinding liquid C to the container 2; The propeller 5 stirs the pure water W and the concentrated grinding liquid C provided to the container 2; the rotating part 6 rotates the propeller 5; the rotational speed detection part 7 detects the rotational speed of the propeller 5; the liquid level detection part 8 , which detects the liquid level Ra of the grinding liquid R in the container 2; 4 for control.

[0015] The container 2 is arranged adjacent to the grinding device. A pump 10 is connected to a lower portion of one side wall 2 b of the container 2 for pumping up the polishing liquid R in the container 2 and supplying it to a not-shown polishing device.

[0016] The pure water supply unit 3 has a pure ...

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Abstract

A method for adjusting the concentration of the grinding liquid is provided to adjust the grinding liquid to an appropriate concentration without wasting the grinding liquid. The method for adjusting the concentration of the grinding liquid has the following steps: providing a process (S1), providing pure water and concentrated grinding liquid to the container; stirring step (S2), rotating the propeller to stir the pure water and concentrated grinding liquid in the container; Judging process (S3), judging whether the rotating speed of the propeller detected in the stirring process (S2) is greater than or lower than the preset rotating speed n; the first adjustment process (S4), when the detected rotating speed is less than the preset rotating speed N (n<N), the container is provided with pure water so that the rotating speed n of the propeller becomes the preset rotating speed N; and the second adjustment process (S5), when the detected rotating speed is greater than the preset rotating speed N (n> In the case of N), the container is provided with the concentrated grinding liquid so that the rotation speed n of the propeller becomes the preset rotation speed N.

Description

technical field [0001] The invention relates to a grinding liquid concentration adjustment method for adjusting the concentration of the grinding liquid. Background technique [0002] CMP (Chemical Mechanical Polishing: chemical mechanical polishing) is used as a method of planarizing the surface of a workpiece such as a semiconductor wafer or a glass substrate. In CMP, a polishing liquid is supplied while pressing a rotating polishing pad against the surface of a workpiece in a polishing apparatus, and polishing is performed by mechanical action of abrasive grains in the polishing liquid and chemical action of the polishing liquid. [0003] As the polishing liquid for CMP, a polishing liquid obtained by diluting a concentrated polishing liquid with pure water outside a polishing apparatus according to a workpiece to be polished is used. In the past, a container is provided in a grinding device, and the concentrated grinding liquid is adjusted to a predetermined concentrati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01F27/90B01F27/191B01F35/221
CPCB01F27/191B01F35/211B01F27/90B01F2101/27Y02P70/10B24B57/02C09K3/1463H01L21/304H01L21/30625
Inventor 山中聪川越大辅
Owner DISCO CORP
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