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Method and sample holder for the controlled bonding of substrates

A technology of substrate and contact surface, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as error-proneness, high cost, and low output, and achieve the effect of reducing distortion

Active Publication Date: 2019-03-19
EV GRP E THALLNER GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the two substrate surfaces are first connected to each other, separation is again theoretically possible but associated with high cost, low yield and error-prone

Method used

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  • Method and sample holder for the controlled bonding of substrates
  • Method and sample holder for the controlled bonding of substrates
  • Method and sample holder for the controlled bonding of substrates

Examples

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Embodiment Construction

[0227] The X-axis runs in the receiving surface 1s, 1s', 1s", 1s'" of the substrate holder 1o or 1u. The Y-axis runs perpendicular to the X-axis and likewise in the receiving surface 1s, 1s of the substrate holder 1o or 1u ', 1s", 1s''' extended. The Z-axis extends perpendicularly to the X-axis and the Y-axis and perpendicularly to the receiving surfaces 1s, 1s', 1s", 1s''' of the substrate holder 1o or 1u.

[0228] 1 a shows a schematic, not to scale partial view of a cross-section of a first embodiment of a holding device 1 according to the invention (alternatively referred to as a substrate holder), wherein only the fastening elements 2 are shown. (Fixing device) edge region R.

[0229] The receiving device 1 is composed of a plurality of zones Zi, which are preferably located in the edge region R. As shown in FIG. Each of the zones Zi can have a plurality of fixation elements 2 . Two zones Z1 and Z2 are shown by way of example in FIG. 1a. Four fastening elements 2 are ...

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Abstract

The present invention relates to a method and a device for bonding a first substrate (4o) with a second substrate (4u) on mutually facing contact surfaces (4k) of the substrates (4o, 4u).

Description

technical field [0001] The invention relates to a method for bonding a first substrate and a second substrate and a corresponding device according to the independent patent claims. Background technique [0002] Since many years, substrates have been connected to one another in the semiconductor industry by so-called bonding processes. Before joining, the substrates must be aligned with one another as precisely as possible, wherein deviations in the nanometer range play a role therebetween. Alignment of the substrate is usually carried out by means of alignment marks. In addition to the alignment marks, other, in particular functional, elements are present on the substrate, wherein these other elements also have to be aligned with one another during the bonding process. This alignment accuracy between the individual functional elements is required for the entire substrate surface. So, for example, it is not sufficient if the alignment accuracy is very good in the center of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/18H01L21/20
CPCH01L21/187H01L21/2007H01L21/67092H01L21/67248H01L21/67259H01L21/67288H01L21/68H01L21/6838H01L21/6833
Inventor D.青纳T.瓦根莱特纳J.M.聚斯J.马林格T.普拉赫
Owner EV GRP E THALLNER GMBH
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