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Power cycle test method and device for intelligent power module

A technology of intelligent power module and power cycle, applied in the direction of measuring device, environment/reliability test, circuit breaker test, etc., can solve the problem that the working status of the intelligent power module cannot be accurately simulated, and achieve a simple and efficient judgment method, The effect of ensuring accuracy

Active Publication Date: 2021-07-20
美垦半导体技术有限公司
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Problems solved by technology

[0004] The embodiment of the present application provides a power cycle test method and device for an intelligent power module, which solves the problem in the prior art that the actual working conditions of the intelligent power The cycle aging test method can accurately and effectively simulate the actual working conditions of the intelligent power module

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  • Power cycle test method and device for intelligent power module
  • Power cycle test method and device for intelligent power module
  • Power cycle test method and device for intelligent power module

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Embodiment Construction

[0028] This application periodically provides a sinusoidal current signal to the switch device under test, and controls the junction temperature of the switch device under test accordingly, so as to realize the AC power cycle of the smart power module, thereby accurately and effectively simulating the power of the smart power module. actual working conditions.

[0029] In order to better understand the above-mentioned technical solutions, exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

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Abstract

This application discloses a power cycle test method and device for an intelligent power module. The intelligent power module includes a constant current source and multiple bridges connected in parallel at both ends of the constant current source. Connecting, the first end of the bridge where the switching device under test is located is connected to the first end of another bridge through a first switch, the method includes: controlling the switching device in the bridge where the switching device under test is located and the switching device in the other bridge to be in an alternate switching state, so that the current flowing through the tested switching device is a sinusoidal current signal; when the junction temperature of the tested switching device is equal to the first set temperature, the first switch is turned off; the tested switching device is cooled, and when the tested switch When the junction temperature of the device is equal to the second set temperature, close the first switch, and return to the step of controlling the switching device in the bridge where the switching device under test is located and the switching device in another bridge to be in an alternate switching state. Therefore, the actual working conditions of the intelligent power module can be accurately and effectively simulated.

Description

technical field [0001] The present application relates to the technical field of intelligent power modules, in particular to a power cycle test method for an intelligent power module and a power cycle test device for an intelligent power module. Background technique [0002] The power cycle accelerated aging experiment is to apply power to the switching device through conduction or high-frequency on-off, resulting in heat loss, causing the temperature of the switching device to fluctuate greatly periodically, forming thermal shock, and generating thermoelectric stress, thereby accelerating the aging process. Its purpose is to understand the relationship between the aging and failure mechanisms of intelligent power modules in a short period of time, and to discover the weak links of switching device packaging, which will help manufacturers to improve and optimize from the material and structure levels. At the same time, it can be used to describe intelligent power modules. Ac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00G01R31/327
CPCG01R31/00G01R31/003G01R31/327
Inventor 马博斌冯宇翔
Owner 美垦半导体技术有限公司
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