Annular micro-channel heat exchanger and fluid flow heat exchange experimental device thereof

A micro-channel heat exchanger and fluid flow technology, which is applied in the direction of modification by conduction heat transfer, cooling/ventilation/heating transformation, electrical components, etc. Low efficiency, unreliable temperature environment of electronic devices, etc., to achieve the effect of improving temperature uniformity, high heat dissipation efficiency, and meeting heat dissipation requirements

Inactive Publication Date: 2019-03-26
南京骐骏软件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, to provide a ring-type microchannel heat exchanger and its fluid flow heat exchange experimental device, which overcomes 1 in the prior art: the traditional heat dissipation method cannot meet the requirements of high-load electronic devices 2: The heat transfer efficiency of traditional heat exchangers is low; 3: The temperature environment of electronic devices is unreliable and other issues

Method used

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  • Annular micro-channel heat exchanger and fluid flow heat exchange experimental device thereof
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specific Embodiment approach

[0027] It should be noted that the structure, ratio, size, etc. illustrated in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not intended to limit the implementation of the present invention. The limitation conditions, any structural modification, proportional relationship change or size adjustment, shall still fall within the scope of the technical content disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention In the range.

[0028] At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for the convenience of description and are not used to limit the text. The scope of implementation of the invention, the change or adjustment of the relative relationship, shall be regarded as the scope of implem...

Embodiment 1

[0030] Such as Figure 1~2 As shown, the present invention discloses a ring-shaped micro-channel heat exchanger, including a substrate 1 and a U-shaped groove 2, wherein there are two U-shaped grooves 2, and the two U-shaped grooves 2 are respectively engaged with the substrate 1 On opposite sides, the base plate 1 includes an upper cover plate 3 and a lower cover plate 4, wherein the lower cover plate 4 is provided with four channels 5, and each channel 5 consists of a primary flow channel 6 and a secondary annular flow channel 7. And the inclined flow channel 8, wherein the primary flow channel 6 of each channel 5 is divided into two parts, and the two primary flow channels 6 are respectively arranged at both ends of the lower cover plate 4. 6 The middle is connected to the secondary annular flow passage 7, wherein the middle area of ​​the secondary annular flow passage 7 is provided with a plurality of inclined flow passages 8. The upper cover plate 3 and the lower cover pla...

Embodiment 2

[0032] Such as Figure 1~2 As shown, the present invention discloses a ring-shaped micro-channel heat exchanger, including a substrate 1 and a U-shaped groove 2, wherein there are two U-shaped grooves 2, and the two U-shaped grooves 2 are respectively engaged with the substrate 1 On opposite sides, the base plate 1 includes an upper cover plate 3 and a lower cover plate 4, wherein the lower cover plate 4 is provided with four channels 5, and each channel 5 consists of a primary flow channel 6 and a secondary annular flow channel 7. And the inclined flow channel 8, wherein the primary flow channel 6 of each channel 5 is divided into two parts, and the two primary flow channels 6 are respectively arranged at both ends of the lower cover plate 4. 6 The middle is connected to the secondary annular flow passage 7, wherein the middle area of ​​the secondary annular flow passage 7 is provided with a plurality of inclined flow passages 8. The upper cover plate 3 and the lower cover pla...

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Abstract

The invention discloses an annular micro-channel heat exchanger and a fluid flow heat exchange experimental device thereof. The annular micro-channel heat exchanger comprises a substrate and two U-shaped grooves, wherein the two U-shaped grooves are engaged with the two opposite sides of the substrate respectively; the substrate comprises an upper cover plate and a lower cover plate; the lower cover plate is provided with four channels; each of the channels consists of a primary flow channel, a secondary annular flow channel and inclined flow channels; the primary flow channel of each channelis divided into two parts which are disposed on two ends of the lower cover plate respectively; the corresponding secondary annular flow channel is connected between the two parts; the inclined flow channels are disposed in the middle area of the secondary annular flow channel; the upper cover plate and the lower cover plate are closed to make each channel be an enclosed independent space with twoopen ends; and a straight line where the four channels are located is in parallel with a straight line where the two U-shaped grooves are located.

Description

Technical field [0001] The invention belongs to the technical field of microchannel enhanced heat dissipation, and in particular relates to a ring-shaped microchannel heat exchanger and a fluid flow heat exchange experimental device. Background technique [0002] With the rapid development of MEMS and VLSI technologies, the volume of electronic equipment is getting smaller and smaller, while the power and integration are greatly improved. The generation of high heat flux has become an irresistible trend. If the heat cannot be taken away quickly, the electronic devices will not work properly due to the high temperature, or even burn out. In addition to ensuring the low temperature of the electronic product, the heat dissipation effect also needs to reduce the temperature difference between the electronic devices. Traditional heat dissipation methods can no longer meet the heat dissipation requirements of high-load electronic devices. For this reason, some new heat dissipation str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20327H05K7/20509
Inventor 刘焕玲齐东浩邵晓东师航波邵毓强
Owner 南京骐骏软件有限公司
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