Laser lift-off device for flexible substrate and laser lift-off method of flexible substrate
A flexible substrate and laser stripping technology, which is applied in the direction of photovoltaic power generation, semiconductor devices, electrical components, etc., can solve the problems of poor adhesion and poor stripping effect of flexible substrates, and achieve the effect of improving adsorption force and effective stripping
Pending Publication Date: 2019-04-12
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
[0003] However, in the prior art, there is a gap between the flexible film and the laser lift-off device and the closeness to each other is poor, thus resulting in poor peeling effect of the flexible substrate
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[0022] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with reference to the attached drawings. Furthermore, the direction terms mentioned in this disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, transverse, vertical, longitudinal, axial , radial direction, the uppermost layer or the lowermost layer, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure.
[0023] In the figures, structurally similar units are denoted by the same reference numerals.
[0024] refer to figure 1 , a laser lift-off device 10 for flexible substrates according to an embodiment of the present disclosure includes a repl...
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Abstract
The invention provides a laser lift-off device for a flexible substrate and a laser lift-off method of the flexible substrate. The laser lift-off device for the flexible substrate comprises a replaceable vacuum absorption platform and a silica gel layer, wherein the silica gel layer comprises an upper surface and a lower surface which are opposite to each other, the material of the silica gel layer is a flexible material, the lower surface of the silica gel layer is embedded onto the replaceable vacuum absorption platform, and the replaceable vacuum absorption platform is used for absorbing the flexible substrate by the upper surface of the silica gel layer. The absorption force between the flexible substrate and the vacuum absorption platform is improved, and the flexible substrate can befurther effectively lifted off.
Description
【Technical field】 [0001] The present disclosure relates to the field of display technology, in particular to a laser lift-off device for flexible substrates and a laser lift-off method for flexible substrates. 【Background technique】 [0002] As the manufacturing technology of flexible displays is becoming more and more mature, it is possible to use the precision coating process to manufacture high-temperature-resistant flexible films on glass substrates, and perform array and organic light-emitting layer processes, and then in module engineering (module) The flexible film is peeled off from the glass substrate by a laser lift off (laser lift off, LLO) process, so as to complete the peeling of the flexible substrate. [0003] However, in the prior art, there is a gap between the flexible film and the laser lift-off device, and the closeness to each other is poor, thus resulting in a poor peeling effect of the flexible substrate. [0004] Therefore, there is a need to provide...
Claims
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Login to View More IPC IPC(8): H01L51/00H01L51/56
CPCH10K71/80H10K77/111H10K71/00Y02E10/549
Inventor 董磊
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD