A kind of preparation method of high thermal conductivity bakeware
A technology of high thermal conductivity and bakeware, which is applied in special containers for baking, kitchen utensils, household utensils, etc. It can solve the problems of copper precipitation and other problems, and achieve the effects of uniform heat transfer, high thermal conductivity, and high thermal conductivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0028] In a preferred embodiment of the present invention, the preparation method of the high thermal conductivity baking pan includes:
[0029] a. Add the aluminum alloy ingot to the melting furnace for melting, and control the melting temperature to 740-760°C;
[0030] b. Add the Al-5B alloy into the melting furnace, control the temperature at 740-760°C, and keep it warm for 0.5-1h;
[0031] c. Add the Al-10Sr alloy into the melting furnace, control the temperature at 740-760°C, and keep it warm for 0.5-1h to obtain the aluminum alloy melt;
[0032] d. After refining, degassing, and slag removal of the aluminum alloy liquid, the die-casting liquid is obtained;
[0033] e. Transfer the die-casting liquid to the high-pressure hydraulic die-casting machine, and die-cast the aluminum alloy baking pan blank through the baking pan mold;
[0034] f. After the aluminum alloy baking pan blank is polished, it is coated to obtain a finished baking pan with high thermal conductivi...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 

