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A kind of light curing pressure-sensitive adhesive and its application

A pressure-sensitive adhesive and light-curing technology, applied in the field of pressure-sensitive adhesives, can solve the problem that the absorption spectrum of the photoinitiator cannot be matched with it, and achieve the effects of good fixed load performance, long effective time and short reaction time.

Active Publication Date: 2021-04-20
SUZHOU FINESET MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its spectral distribution is concentrated at 365nm to 395nm, and the absorption spectrum of most photoinitiators cannot match it

Method used

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  • A kind of light curing pressure-sensitive adhesive and its application
  • A kind of light curing pressure-sensitive adhesive and its application
  • A kind of light curing pressure-sensitive adhesive and its application

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Experimental program
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preparation example Construction

[0025] 1. Preparation of acrylic resin pulp

[0026] Here, the raw materials for the preparation of acrylic resin syrup are as follows: the acrylate monomer is selected from isooctyl acrylate or a mixture of isooctyl acrylate and butyl acrylate; the carboxyl group-containing monomer is selected from acrylic acid; the thermal initiator is selected from azo Diisobutyronitrile; n-dodecyl mercaptan was selected as the chain transfer agent.

[0027] Concrete preparation steps are as follows:

[0028] Add acrylic acid (AA), isooctyl ester (2-EHA), butyl acrylate (BA) and n-dodecyl mercaptan (NDM) into a four-necked flask with a reflux condenser, stir and mix under nitrogen flow After 30 minutes, azobisisobutyronitrile (AIBN) was added and reacted at 60°C for 30 minutes to obtain acrylic resin syrup. The thermal reaction is adopted to prepare the acrylic resin slurry, the reaction time is short, and no serious heating is caused, and compared with the ultraviolet light irradiation r...

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Abstract

The invention discloses a photocurable pressure-sensitive adhesive and its application. The pressure-sensitive adhesive contains acrylic resin pulp, a photoinitiator and a crosslinking agent, wherein the acrylic resin pulp contains 15% to 40% by weight on average Acrylic polymer with a molecular weight of 500,000 to 2 million, and the remainder is monomers. The monomers in the acrylic resin syrup include acrylate monomers with 1 to 18 carbon atoms and carboxyl-containing monomers; the amount of photoinitiator is acrylic acid 0.08%~0.15% of the mass of the resin pulp; the crosslinking agent includes an epoxy crosslinking agent containing aniline structure, and the amount of the crosslinking agent is 0.005%~3% of the mass of the acrylic resin pulp. The pressure-sensitive adhesive of the present invention has long effective time, strong adhesion, no organic solvent in use, and thin coating thickness, and the products prepared by using the pressure-sensitive adhesive of the present invention have excellent constant load performance.

Description

technical field [0001] The invention relates to the technical field of pressure-sensitive adhesives, in particular to a photocurable pressure-sensitive adhesive and its application. Background technique [0002] Pressure-sensitive adhesives are a type of pressure-sensitive adhesives that can stick to other surfaces with appropriate pressure during use. Due to their special adhesive properties, pressure-sensitive adhesive products are currently widely used in printing, packaging, and electronic products. and other industries. However, electronic products such as smart phones, tablet computers, automotive products and other mobile terminals have the trend of small, light, thin and high production efficiency. Accordingly, more and more polymer materials are required for electronic products, and these materials are required The adhesive products used have a high bond strength, resulting in a strong bond with a small bonding area. [0003] Common pressure-sensitive adhesives in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/38C09J7/10C09J4/02C09J4/06C09J11/06C08F220/18C08F220/06
CPCC09J4/06C09J7/10C09J7/385C09J11/06C08F220/18C09J2433/00C08F220/1808C09J2301/302C08F220/06C08F220/1804
Inventor 安明星高昂杨春强朱敏芳邹学良
Owner SUZHOU FINESET MATERIAL TECH CO LTD