Circulating liquid type suction head and method for removing particles in wafer
A technology for circulating liquids and wafers, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as difficult removal of particles
Inactive Publication Date: 2019-04-23
SIEN QINGDAO INTEGRATED CIRCUITS CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and seek a negative pressure method for removing particles in the wafer, which solves the existing cleaning method. During the cleaning process, it is easy to form a special pattern of linear rotation. And the problem that the particles embedded in the pattern are difficult to remove, improve the removal rate of the particles on the wafer surface, and finally achieve the purpose of improving the wafer manufacturing yield
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Embodiment 1
[0021] Such as image 3 As shown, this embodiment involves a circulating liquid suction head for wafer cleaning, including a nozzle 2 and a suction nozzle 1, the nozzle 2 continuously ejects liquid, and then, under the action of external pressure, the The suction nozzle 1 sucks the ejected liquid away.
[0022] Preferably, the suction nozzle 1 is located at the center, and the ring-shaped nozzle 2 surrounds the outside of the suction nozzle 1 to form a circulating liquid suction head with an integrated structure.
[0023] A negative-pressure method for cleaning particles in a wafer according to this embodiment specifically includes the following steps:
[0024] (A1) Determine the cleaning strategy: the wafer inspection system detects the particle coordinates in the wafer to obtain the number and distribution of particles on the wafer, and then imports the particle coordinates into the vertical cleaning system, which compares the particle distribution map with the integrated c...
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The invention discloses a circulating liquid type suction head and a method for removing particles in a wafer. The circulating liquid type suction head comprises a nozzle and a suction nozzle, and thenozzle of the circulating liquid type suction head and the opening of the annular nozzle are vertically aligned to the surface of the wafer, in the scanning process in the wafer surface pattern direction, the annular nozzle sprays cleaning liquid on the surface of the wafer, then under the external pressure, the nozzle absorbs the cleaning liquid, the particles infiltrated by the cleaning solution are removed, and in the cleaning process, the circulating liquid type suction head or a wafer is moved to achieve scanning of the whole wafer surface by employing the circulating liquid type suctionhead. The method can prevent particles from being crushed into the pattern, can effectively absorb out the particles inlaid in the pattern, cannot scratch the pattern in the horizontal direction andhas the same effect on the cleaning of the whole wafer surface.
Description
Technical field: [0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to a circulating liquid suction head and a method for removing particles in wafers. Background technique: [0002] Wafer cleaning is an important process in the wafer manufacturing process, mainly to remove organic compounds, metal impurities or particles attached to the wafer surface. Wafer cleaning technology and cleanliness are related to wafer yield, device quality and reliability. Generally speaking, wafer cleaning can be divided into wet cleaning and dry cleaning. Dry cleaning uses gas-phase chemicals, generally by providing excitation energy to promote chemical reactions for empirical cleaning, where energy can be provided in the form of heat, plasma, or radiation. Commonly used wet cleaning uses liquid chemicals, such as solvents, acids, surfactants, and water, to remove pollutants by spraying, scrubbing, oxidation, and etching. Wetting cleaning...
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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67051
Inventor 王通许继仁林庆儒
Owner SIEN QINGDAO INTEGRATED CIRCUITS CO LTD