Camera module, photosensitive component, and packaging method thereof

Abstract

The invention discloses a camera module, and a photosensitive component and a packaging method thereof. The photosensitive component comprises: a circuit board, a photosensitive element, a molding base, a step rubber, and a filter element, wherein the photosensitive element is electrically connected to the circuit board and has a photosensitive region and a non-photosensitive region, the step rubber is circumferentially disposed on the non-photosensitive region of the photosensitive element, the molding base is integrally bonded to the circuit board, the photosensitive element, and the step rubber and has an extended surface integrally extending from the step rubber; the filter element is supported by the step rubber to buffer a buffer stress when the filter element is mounted, and the filter element is spaced from the extended surface of the molding base, wherein a light window is provided between the filter element, the step rubber, and the photosensitive element to provide a light path for the photosensitive element.

Description

technical field [0001] The invention relates to the field of camera modules, in particular to a camera module based on an integrated packaging process, a photosensitive component and a packaging method thereof. Background technique [0002] Camera modules are one of the indispensable components of smart electronic devices, such as but not limited to smart phones, cameras, computer equipment, wearable devices and other smart electronic devices. In the development trend of thinner, lighter and more integrated smart devices, the requirements for camera modules are getting higher and higher. [0003] In particular, in recent years, with the popularization and development of smart devices, they tend to be thinner and lighter. Correspondingly, the camera module needs to adapt to the development, and it also requires more and more multi-functional integration, thinner and smaller, so that the camera module The volume required to be assembled in the intelligent electronic device ca...

AI Technical Summary

Problems solved by technology

And if it is directly attached to the photosensitive chip 3, and then the molded part 1 is formed, the molding surface of the mold needs to be pressed against the optical filter 4, which may cause damage to the optical filter.

Moreover, the molding part 1 is usually a thermosetting material, which needs to be thermoset at a relatively high temperature, which will cause the glue connecting the optical filter 4 and the photosensitive chip 3 to shrink after curing, so that the optical filter 4 is subjected to Cracks or even rupture due to uneven force

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