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Photographing module group array and corresponding integrated substrate

A camera module and an integrated technology, applied in the field of optics, can solve the problems of cost increase and module size increase, and achieve the effects of cost saving, structural strength enhancement and production process reduction

Pending Publication Date: 2019-04-26
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above scheme also has problems such as increased module size and increased cost.

Method used

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  • Photographing module group array and corresponding integrated substrate
  • Photographing module group array and corresponding integrated substrate
  • Photographing module group array and corresponding integrated substrate

Examples

Experimental program
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Embodiment Construction

[0061] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0062] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0063] In the drawings, the thickness, size and shape of objects have been slight...

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Abstract

The invention provides an integrated substrate used for a photographing module group array. The substrate includes a circuit board, which has a first region suitable for mounting a first optical component including a first lens and a second region suitable for mounting a second optical component including a second lens, and also has a first surface adjacent to the first lens and the second lens and a second surface opposite the first surface; and a molding portion, which is integrally formed on the second surface of the circuit board through molding technology, and covers at least one portionwhich is of the second surface and corresponds to the first region and at least one portion corresponding to the second region. The integrated substrate has a first flat surface and a second flat surface. The invention also provides the corresponding photographing module group array. The substrate can improve structure strength of the substrate, can better adapt to dual photographing module groupswith two different optical designs, facilitates reducing of the size of the dual photographing module groups, and reduces costs.

Description

technical field [0001] The present invention relates to the field of optical technology, and in particular, the present invention relates to a solution of a camera module array and a corresponding integrated substrate. Background technique [0002] With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. For example, in the past two years, the camera of a smart phone has changed from a single camera to a dual camera, and the development of a dual camera module has also become an important trend in the development of mobile phone camera modules. To put it simply, dual cameras can collect images through the cooperation of two cameras, so as to achieve richer image collection functions. The existing dual cameras can be divided into two categories according to their functions: one is to use the dual cameras to generate stereo vision, obtain the depth of field of the image, and use the depth of field information to perf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225G02B7/00G03B17/12G03B17/14G03B30/00
CPCH04M1/0264G02B7/006G03B17/12G03B17/14H04N23/45H04N23/54H04N23/50H04N23/57H04N23/55
Inventor 田中武彦陈振宇梅哲文方银丽吴业苏小娟郭楠
Owner NINGBO SUNNY OPOTECH CO LTD