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Mobile terminal heat dissipation structure and mobile terminal

A mobile terminal and heat dissipation structure technology, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of poor heat dissipation effect of mobile terminals, and achieve the effect of strengthening heat dissipation effect.

Inactive Publication Date: 2019-04-26
HUAQIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a heat dissipation structure of a mobile terminal and the mobile terminal, which are used to solve the technical problem of poor heat dissipation effect of the mobile terminal in the prior art

Method used

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  • Mobile terminal heat dissipation structure and mobile terminal
  • Mobile terminal heat dissipation structure and mobile terminal
  • Mobile terminal heat dissipation structure and mobile terminal

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] When the mobile terminal is in use, its circuit board, metal structure, flashlight and other structures will generate heat. If the heat cannot be dissipated out of the mobile terminal in time, it will have a negative impact on the overall performance of the mobile terminal.

[0035] by figure 1 The mobile terminal shown is taken as an example. The embodiment of the present invention provides a heat dissipation structure for a mobile terminal, including:...

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Abstract

The invention relates to the field of mobile terminal architecture, and discloses a mobile terminal heat dissipation structure and a mobile terminal. The mobile terminal heat dissipation structure includes a heat dissipation channel disposed in the mobile terminal, and the heat dissipation channel is provided with at least one air inlet and at least one air outlet. The air inlets and the air outlets are located in the surface of the mobile terminal and communicate with the outside, and a fan assembly is disposed in the heat dissipation channel. The heat dissipation channel communicates with the outside through the air inlets and the air outlets, and a flow path of airflow is formed in the mobile terminal. The fan assembly disposed in the heat dissipation channel can drive air in the heat dissipation channel to flow, the air in the heat dissipation channel can be subjected to loop interchange with outside air, in the process, the mobile terminal generates heat exchange with flowing gasin the heat dissipation channel, and finally the heat is discharged to the outside with the airflow, so that the heat dissipation effect of the mobile terminal is enhanced.

Description

technical field [0001] The invention relates to the technical field of mobile terminal architecture, in particular to a heat dissipation structure of a mobile terminal and the mobile terminal. Background technique [0002] As a daily communication tool, mobile terminals are increasingly inseparable from people's lives. With the development of science and technology, the functions of mobile terminals are becoming more and more perfect, and the processing capacity of the central processing unit is also getting stronger. What follows is that the heat generated by the mobile terminal is also quite large. The overheating of the mobile terminal seriously affects the service life of the mobile terminal, and even causes the mobile terminal to fail to work normally. Although the mobile terminal itself has a heat dissipation device, it often does not achieve the expected heat dissipation. As a result, there are still many mobile terminals that are hot during use, which is not conduciv...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 武乐强
Owner HUAQIN TECH CO LTD
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