Display panel, manufacturing method thereof, and display device
A technology for display panels and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of low transmittance of adhesive materials and inability to meet the requirements of display panel transmittance, and meet the requirements of transmittance. The effect of excessive demands
Active Publication Date: 2021-01-15
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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- Application Information
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Problems solved by technology
However, due to the light scattering and water absorption of the desiccant particles, the transmittance of the adhesive material is low, which cannot meet the transmittance requirements of the display panel.
Method used
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[0024] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.
[0025] see figure 1 with figure 2 , figure 1 is a schematic top view structure diagram of the display panel provided by the embodiment of the present application, figure 2 is along figure 1 Schematic diagram of the cross-sectional structure taken by the line O-O' in . The display panel 10 includes a base substrate 11 , and an organic light emitting device 12 and a packaging structure 13 disposed on the base substrate 11 . The base substr...
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Abstract
The present application relates to a display panel, a manufacturing method thereof, and a display device. The display panel includes a base substrate, an organic light-emitting device and a packaging structure disposed on the base substrate, and the base substrate includes a display area and a display area around the display area. In the non-display area, the organic light-emitting device is located in the display area, and the packaging structure includes a first adhesive layer arranged on the base substrate and covering the organic light-emitting device, a water-absorbing layer arranged on the first adhesive layer and surrounding the edge of the display area, and a The second adhesive layer is on the first adhesive layer and covers the water absorption layer, and the barrier layer is arranged on the second adhesive layer. In this way, the adhesive layer of the packaging structure adopts the method of setting a water-absorbing layer between the two adhesive layers, and the water-absorbing layer is arranged around the display area, which can prevent water vapor from invading the organic light-emitting device from the outside of the adhesive layer, not only It can meet the requirements for the life of the package and also meet the requirements for the transmittance.
Description
【Technical field】 [0001] The present application relates to the technical field of display panels, in particular to a display panel, a manufacturing method thereof, and a display device. 【Background technique】 [0002] At present, the main packaging method for top-emitting large-size flexible OLED TVs is surface-mounted packaging. The surface-mounted packaging material is mainly composed of a barrier film and a surface-mounted packaging adhesive, and is generally attached to both sides of the flexible substrate. Bonded with surface mount encapsulation material. Since the packaging requirements of OLED TVs are much higher than those of small-sized OLED displays, this puts forward higher requirements for the surface-mounted packaging materials of large-sized flexible OLED TVs. [0003] In the prior art, the surface-mounted packaging adhesive used for bottom-emitting OLED devices contains MxO (metal oxide) particles as a desiccant for water absorption, and its particle size is...
Claims
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IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/874H10K59/80H10K59/8722
Inventor 杨中国吴元均李金川
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD