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Display panel frame packaging method and display panel

A display panel and packaging method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., to meet the packaging life requirements, improve the packaging effect, and avoid the effect of high temperature damage

Active Publication Date: 2020-09-01
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disclosure provides a display panel frame packaging method and a display panel for solving the problems of the prior art

Method used

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  • Display panel frame packaging method and display panel
  • Display panel frame packaging method and display panel
  • Display panel frame packaging method and display panel

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Embodiment Construction

[0034] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present disclosure may be practiced. The directional terms mentioned in this disclosure, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure. In the figures, structurally similar elements are denoted by the same reference numerals.

[0035] The disclosure will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0036] This disclosure provides a display panel frame packaging method, combined with the following Figure 1 to Figure 8 Describe in detail.

[0037] like figure 1 as shown, figure 1 A schematic flowchart of a display panel frame packag...

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Abstract

The disclosure provides a display panel and a frame packaging method of the display panel. The display panel includes: a first substrate, a display device layer is provided on the first substrate, and a plurality of barrier walls are arranged at intervals on both sides of the display device layer. and a second substrate, the second substrate is arranged on the first substrate, the side of the second substrate close to the first substrate is provided with a filling glue layer, and the two sides of the filling glue layer are provided with glass glue The denser glass glue can reduce the frame width of the display panel. The edge connection part of the first substrate and the second substrate is coated with sealant, and the sealant penetrates into the pores and cracks formed after the glass glue is sintered, effectively preventing water vapor from invading and improving The encapsulation effect of the display panel meets the encapsulation life requirement of the display panel.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel frame packaging method and a display panel. Background technique [0002] At present, the packaging methods of large-size Organic Light-Emitting Diode (OLED) display panels mainly include surface-mounted packaging, frame glue, moisture absorbent, and filler packaging. Generally, there are 3- With a distance of 4mm, the width of the frame adhesive and moisture absorbent is about 2mm, so whether it is a surface-mounted package or a frame adhesive, moisture absorbent, and filler package, it is difficult to form a narrow frame package less than 2mm. For small-sized OLED devices, glass glue packaging is usually used for packaging, but because large-sized display panels have higher requirements on life, after laser sintering, there will be some pores and cracks, which provide water vapor intrusion channels , making the encapsulation effect worse. Therefore, glass glu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K59/87
Inventor 杨中国
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD