Manufacturing method of golden finger circuit board

Abstract

The invention relates to the technical field of printed circuit boards, and in particular to a manufacturing method of a golden finger circuit board. According to the manufacturing method provided bythe invention, an adhesive tape is laminated in a golden finger area at first before an outer layer circuit pattern is electroplated to improve the groove sealing ability of a dry film, so as to prevent liquid medicine from infiltrating during electrocoppering and electrotinning to plate copper and tin on the golden finger; a golden finger area pattern is not only manufactured before tin removal to cover the golden finger area, the adhesive tape is also laminated in the golden finger area to improve the groove sealing ability of a dry film, so as to prevent the tin removal liquid medicine frominfiltrating to etch a golden surface of the golden finger; and before nickel and gold are deposited on PAD, the adhesive tape is laminated in the golden finger area to seal a groove on the side wallof the golden finger, so as to prevent nickel and gold deposition liquid medicine from infiltrating to form double-layer nickel and gold on the golden finger, therefore the manufacture of the circuitboard having the golden finger with three gilded surfaces and the PAD with the deposited nickel and gold is achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a golden finger circuit board. Background technique [0002] In the field of printed circuit boards, gold fingers are often designed on circuit boards such as memory sticks, graphics cards, network cards, etc., which are equipped with electronic components, as a connecting part between such circuit boards and slots. Gold fingers are composed of many golden yellow conductive contacts arranged in the same order. Because the surface is gold-plated and the conductive contacts are arranged in a finger shape, they are called "gold fingers". This kind of circuit with gold fingers is designed on the edge or inside the board The board is called a gold finger circuit board. [0003] The conventional manufacturing process of the gold finger circuit board includes designing a lead wire connected to the edge of the metal plate at the outer end of the...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the above-mentioned problems in the prior art of making a gold-finger circuit board with gold-plated gold on three sides, and provides a method for making a gold-finger circuit board that can realize three-side gold-plated gold-finger and nickel-gold-impregnated PAD on the board surface. It is suitable for the production of gold finger circuit boards with a board thickness less than 1.0mm and a gold finger side wall groove larger than 2.5mm×9mm. The gold surface of the gold finger has no quality problems such as copper plating, pollution, and double nickel gold

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