A kind of manufacturing method of golden finger circuit board

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a golden finger circuit board. The present invention sticks pressure tape on the gold finger area before electroplating the outer layer circuit pattern to enhance the sealing ability of the dry film, prevent the liquid medicine from infiltrating during electroplating copper and electrotin, and plate copper and tin on the gold finger; Before tinning, not only the pattern of the gold finger area is made to cover the gold finger area, but also the tape is pasted on the gold finger area to enhance the sealing ability of the dry film and prevent the tin stripping solution from penetrating and biting the gold surface of the gold finger; Before nickel gold, put pressure tape on the gold finger area to seal the side wall groove of the gold finger, so as to prevent the penetration of the nickel gold solution and cause the gold finger to form a double layer of nickel gold, so as to realize the three-sided gold-plated gold finger and the gold finger. The production of the circuit board of Immersion Nickel Gold PAD.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a golden finger circuit board. Background technique [0002] In the field of printed circuit boards, gold fingers are often designed on circuit boards such as memory sticks, graphics cards, network cards, etc., which are equipped with electronic components, as a connecting part between such circuit boards and slots. Gold fingers are composed of many golden yellow conductive contacts arranged in the same order. Because the surface is gold-plated and the conductive contacts are arranged in a finger shape, they are called "gold fingers". This kind of circuit with gold fingers is designed on the edge or inside the board The board is called a gold finger circuit board. [0003] The conventional manufacturing process of the gold finger circuit board includes designing a lead wire connected to the edge of the metal plate at the outer end of the...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the above-mentioned problems in the prior art of making a gold-finger circuit board with gold-plated gold on three sides, and provides a method for making a gold-finger circuit board that can realize three-side gold-plated gold-finger and nickel-gold-impregnated PAD on the board surface. It is suitable for the production of gold finger circuit boards with a board thickness less than 1.0mm and a gold finger side wall groove larger than 2.5mm×9mm. The gold surface of the gold finger has no quality problems such as copper plating, pollution, and double nickel gold

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