IC (integrated circuit) turning mechanism for fully-automatic COG (Chip On Glass) bonder

Abstract

The invention discloses an IC (integrated circuit) turning mechanism for a fully-automatic COG (Chip On Glass) bonder. The IC turning mechanism comprises a turning part and a carrying part; accordingto the turning part, a rotary air cylinder and a lifting motor are combined, so that the turning and vertical movement of a turning table can be realized; according to the carrying part, a multi-motor, multi-guide rail and multi-slider combined mode is adopted, so that the horizontal movement and rotation of a carrying table can be realized; thus, the three-dimensional movement and angle control of the relative movement of the turning table and the carrying table can be realized, and the relative positional relationships between the turning table and the carrying table can be accurately adjusted, so that the accurate turning and receiving of ICs can be realized. Compared with the prior art, the mechanism can adapt to more complicated turning situations and avoid problems such as large error and low efficiency which may occur due to manual operation.

Description

technical field [0001] The invention relates to an IC overturning mechanism, in particular to an IC overturning mechanism of a fully automatic COG bonding machine. Background technique [0002] With the continuous development of science and technology, the rapid rise of artificial intelligence, and the gradual intensification of market competitiveness, the most important thing to ensure the precision and accuracy of the equipment is to ensure that the fully automatic COG bonding machine is in a leading position in the field of integrated circuits. . [0003] The fully automatic COG bonding machine of the prior art is suitable for IC (chip) loading method relatively single, and the degree of freedom of movement is small, which cannot meet the needs of the existing market, and even the situation of manually flipping the IC may occur, which not only wastes manpower, but also A lot of time wasted, and the most important thing is to affect the work efficiency of the whole equipm...

AI Technical Summary

Problems solved by technology

[0003] The fully automatic COG bonding machine of the prior art is suitable for IC (chip) loading method relatively single, and the degree of freedom of movement is small, which cannot meet the needs of the existing market, and even the situation of manually flipping the IC may occur, which not only wastes manpower, but also A lot of time wasted, the most important thing is to affect the work efficiency of the whole equipment

Images