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Connection structure, circuit connection member and adhesive composition

A technology for connecting structural bodies and circuit components, which is applied in the direction of connection, circuits, adhesives, etc., and can solve the problems that the interaction between the circuit connection components and the circuit components cannot effectively function, and the circuit connection components peel off, etc.

Active Publication Date: 2021-08-03
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, according to the studies of the inventors of the present invention, in the case of using the above-mentioned additives, there is a problem that the interaction between the circuit connection member and the circuit member is different depending on the type of the circuit member in a high-temperature and high-humidity environment. Cannot function effectively, the circuit connecting member will peel off from the circuit member

Method used

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  • Connection structure, circuit connection member and adhesive composition
  • Connection structure, circuit connection member and adhesive composition
  • Connection structure, circuit connection member and adhesive composition

Examples

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Embodiment

[0100] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to an Example.

[0101]

[0102] In a separable flask equipped with a reflux cooler, a thermometer, and a stirrer, 1000 parts by mass of polypropylene glycol (number average molecular weight: 2000) as a diol having an ether bond and 4000 parts by mass of methyl ethyl ketone as a solvent were added, Stir at 40°C for 30 minutes. After raising the temperature of this solution to 70 degreeC, 0.127 mass parts of dimethyl tin laurate was added as a catalyst. Next, to this solution, a solution prepared by dissolving 125 parts by mass of 4,4'-diphenylmethane diisocyanate in 125 parts by mass of methyl ethyl ketone was added dropwise over 1 hour. Then, stirring was continued at 70° C. until the absorption peak derived from the NCO group could not be observed by an infrared spectrophotometer, thereby obtaining a methyl ethyl ketone solution of the polyurethane resin. Th...

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Abstract

The present invention provides a connection structure comprising: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; A circuit connection member in which the first circuit electrode and the second circuit electrode are electrically connected to each other, and the linear thermal expansion L(t) of the circuit connection member at a temperature t satisfies dL(t) at least any one of t=30° C. to 12° C. ) / dt<0 condition.

Description

technical field [0001] The present invention relates to a connection structure, a circuit connection member, and an adhesive composition. Background technique [0002] Conventionally, in semiconductor elements and display elements, various adhesives have been used for the purpose of bonding various circuit members in the elements. Adhesives are required to have various characteristics including heat resistance and reliability under high-temperature and high-humidity conditions in addition to adhesiveness. In addition, since circuit members use organic substrates such as printed wiring boards and polyimide, or metals such as titanium, copper, and aluminum, ITO, IZO, IGZO, SiN, and SiO 2 For components with various surface states, the material used for the adhesive needs to be molecularly designed according to the circuit component. [0003] Recently, amorphous (amorphous) ITO films, organic insulating films, and the like are increasingly used in circuit members for the purp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01C09J201/00
CPCH01R11/01C09J175/14C08L75/08C08L71/12C09J201/00
Inventor 森尻智树久米雅英田中胜竹田津润
Owner RESONAC CORPORATION