Die cutting process of adhesive product and adhesive product thereof

Abstract

The invention relates to the technical field of adhesive products and discloses a die cutting process of an adhesive product and an adhesive product thereof. The die cutting process comprises the following steps: S1, compounding a substrate protection film on a non-release surface of a release film; S2, carrying out die cutting of a waste discharging blade line on the release film, wherein the waste discharging blade line penetrates through the release film along a length direction of the release film, and the waste discharging blade line penetrates through an area corresponding to a silica gel product compounded on the release film of the release film; S3, covering the silica gel product on the release surface of the release film, wherein the silica gel product is located at the positionof the waste discharging blade line on the release film; S4, compounding a protection film on a non-gel surface of the silica gel product; and S5, removing the substrate protection film to obtain a finished adhesive product. Through the die cutting process, the defects of insufficient quantity and displacement of the finished product can be avoided; and the yield of the product is improved. According to the adhesive product, the waste discharging blade line is arranged on the release film, so that the situation that the silica gel product is taken away by the release film when discharging thewaste release film along the waste discharging blade line is avoided.

Description

technical field [0001] The invention relates to the technical field of adhesive products, in particular to a die-cutting process of adhesive products and adhesive products. Background technique [0002] With the rapid development of the electronics industry, the die-cutting process has gradually expanded from the traditional die-cutting of printed matter to the production of auxiliary materials for electronic products, such as the preparation of electronic product bonding, dustproof, shockproof, and insulation by die-cutting technology , Shielded adhesive products and film products. [0003] The traditional process of die-cutting adhesive products generally includes the following steps: composite release film and protective film; die-cut release film, waste discharge (release film); die-cut protective film, waste discharge (protective film) , to obtain the finished adhesive product. [0004] At present, due to the development trend of portable and thinner electronic produc...

AI Technical Summary

Problems solved by technology

Use the traditional die-cutting process to process small high-viscosity silicone-based adhesive products. When the release film waste is removed after the die-cutting of the silicone-based products, due to the high viscosity of the silicone-based products, the adhesive effect between the silicone products and the release film The force is greater than the force between the high-viscosity silicone products and the protective film. When the release film is discharged, the high-viscosity silicone products are easily taken away by the release film, resulting in defects such as lack of finished products and displacement, and the product yield is greatly reduced.

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