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Electronic chip packaging structure for marking metal object and packaging method thereof

A technology for electronic chips and metal marking, which is applied to record carriers used in machines, instruments, computer parts, etc. It can solve the problems of weak adhesion, protruding from the surface of objects or unreliable implantation, etc., and achieve the effect of beautiful surface

Inactive Publication Date: 2019-06-07
赵宏达
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These marking methods all have shortcomings such as weak adhesion, protruding from the surface of the object or unreliable implantation.

Method used

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  • Electronic chip packaging structure for marking metal object and packaging method thereof
  • Electronic chip packaging structure for marking metal object and packaging method thereof
  • Electronic chip packaging structure for marking metal object and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] like Figure 1 to Figure 6 As shown, the present invention provides an electronic chip package structure for marking metal objects, including a secondary package, and the secondary package includes an RFID electronic chip 1, a non-metal package 2 and a metal package 3, and the RFID electronic chip 1. Encapsulate in the non-metallic package 2 using the existing packaging method to form a package with the RFID electronic chip 1, and package the package with the RFID electronic chip 1 in the metal package 3 to form a secondary package; specifically Yes, the periphery of the package with the RFID electronic chip 1 is provided with a raised edge 5, and the inner wall of the metal package 3 is provided with a groove 6 matching the raised edge 5, through the cooperation between the raised edge 5 and the groove 6 achieve fixation.

[0030] The package structure also includes a metal object 7 to be marked, and an implant groove 9 suitable for the secondary package is opened on ...

Embodiment 2

[0040] like Figure 7 to Figure 9 As shown, the present invention provides an electronic chip package structure for marking metal objects, including a secondary package, and the secondary package includes an RFID electronic chip 1, a non-metal package 2 and a metal package 3, and the RFID electronic chip 1. Encapsulate in the non-metallic package 2 using the existing packaging method to form a package with the RFID electronic chip 1, and package the package with the RFID electronic chip 1 in the metal package 3 to form a secondary package; specifically Yes, the periphery of the package with the RFID electronic chip 1 is provided with a raised edge 5, and the inner wall of the metal package 3 is provided with a groove 6 matching the raised edge 5, through the cooperation between the raised edge 5 and the groove 6 achieve fixation.

[0041] The packaging structure also includes a nameplate base material 8, and the nameplate base material 8 is provided with an implant hole 10 su...

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PUM

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Abstract

The invention discloses an electronic chip packaging structure for marking a metal object and a packaging method thereof. The structure includes a secondary package, the secondary package comprises anRFID electronic chip, a nonmetal packaging body and a metal packaging body, the RFID electronic chip is packaged in the nonmetal packaging body to form the packaging body with the RFID electronic chip, and the packaging body with the RFID electronic chip is packaged in the metal packaging body to form the secondary packaging body; the packaging structure further comprises a to-be-marked metal object or nameplate base material. An implantation groove or an implantation hole matched with the secondary packaging body is formed in a to-be-marked metal object or nameplate base material, the secondary packaging body is assembled in the implantation groove or the implantation hole in a welded mode, and the outer surface of the nonmetal packaging body, the outer surface of the metal packaging body and the outer surface of the to-be-marked metal object or nameplate base material are flush. According to the invention, the implantation problem of the RFID electronic chip in a metal object is solved, the function of firmly and safely implanting the metal object without influencing signal transmission is realized, and the surface is attractive.

Description

technical field [0001] The invention belongs to the technical field of application of the Internet of Things, and in particular relates to an electronic chip packaging structure and a packaging method for marking metal objects. Background technique [0002] Under the background of the great development of the Internet of Things, the Internet of Everything, in which there are a wide variety of items, all need to be coded to identify and mark the code on the marked object for easy identification and application. With the promotion of RFID electronic chip identification technology, it has broad application prospects in the field of Internet of Things. However, due to the limitation that RFID signals cannot penetrate metal, it often adopts the method of surface sticking or riveting in the process of marking metal objects, and also uses the method of implant packaging. These marking methods all have shortcomings such as weak adhesion, protruding from the surface of objects or in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 赵宏达
Owner 赵宏达