Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of gan-based light-emitting diode epitaxial wafer and preparation method thereof

A technology of light-emitting diodes and epitaxial wafers, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the recombination efficiency of electrons and holes, strong piezoelectric polarization effect, affecting the internal quantum efficiency of light-emitting diodes, etc. Gram effect, eliminate piezoelectric field, improve the effect of internal quantum efficiency

Active Publication Date: 2020-05-19
HC SEMITEK SUZHOU
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the present invention, the inventors found that the prior art has at least the following problems: GaN material has a large spontaneous polarization, and the heterostructure formed in GaN material has a strong piezoelectric polarization effect
The piezoelectric field will cause the quantum confinement Stark effect, and the quantum confinement Stark effect will reduce the recombination efficiency of electrons and holes in the active layer, thereby affecting the internal quantum efficiency of the LED

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of gan-based light-emitting diode epitaxial wafer and preparation method thereof
  • A kind of gan-based light-emitting diode epitaxial wafer and preparation method thereof
  • A kind of gan-based light-emitting diode epitaxial wafer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] figure 1 It shows a GaN-based light-emitting diode epitaxial wafer provided by an embodiment of the present invention, see figure 1 , the epitaxial wafer includes: a sapphire substrate 31 , a buffer layer 32 sequentially deposited on the sapphire substrate 31 , an undoped GaN layer 35 , an N-type layer 36 , an active layer 37 and a P-type layer 38 . Wherein, the active layer 37 includes several stacked well barrier layers 370 , and the well barrier layers 370 include quantum well layers 371 and quantum barrier layers 372 . The quantum well layer 371 in the well barrier layer 370 close to the N-type layer 36 is in contact with the N-type layer 36 . The quantum barrier layer 372 in the well barrier layer 370 close to the P-type ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a GaN-based light-emitting diode epitaxial wafer and a preparation method thereof, and belongs to the technical field of light-emitting diodes. The epitaxial wafer includes a sapphire substrate, and a buffer layer, an undoped GaN layer, an N-type layer, an active layer and a P-type layer which are deposited in order on the sapphire substrate. The active layer comprises a plurality of stacked well barrier layers, each well barrier layer comprises a quantum well layer and quantum barrier layer, the quantum well layers in the well barrier layers close to the N-type layer are in contact with the N-type layer, the quantum barrier layers in the well barrier layers close to the P-type layer are in contact with the P-type layer, the quantum well layers are InGaN quantum well layers, and the quantum barrier layers are a periodic structure with alternate growth of BGaN layers and InGaN layers.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a GaN-based light-emitting diode epitaxial wafer and a preparation method thereof. Background technique [0002] GaN (Gallium Nitride) is a typical representative of the third-generation wide-bandgap semiconductor materials. It has excellent high thermal conductivity, high temperature resistance, acid and alkali resistance, and high hardness. It is widely used in the production of blue, green, and ultraviolet led. GaN-based light emitting diodes generally include an epitaxial wafer and electrodes disposed on the epitaxial wafer. [0003] An existing epitaxial wafer of a GaN-based light-emitting diode includes a substrate and a GaN epitaxial layer grown on the substrate. The GaN epitaxial layer includes a sequentially stacked buffer layer, an undoped GaN layer, an N-type layer, an active layer (also known as a multi-quantum well layer) and a P-type layer. Among th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/06H01L33/32H01L33/00
Inventor 苏晨王慧肖扬胡加辉李鹏
Owner HC SEMITEK SUZHOU