Manufacturing method of mems microphone carrier board with porous sound inlet and single hole sound transmission
A manufacturing method and microphone technology, applied in the direction of electrostatic transducer microphones, sensors, electrical components, etc., can solve the problems of increasing the overall thickness of the finished MEMS microphone, limiting the lifting space of the MEMS microphone, and the limited space of the opening of the steel sheet, etc. Achieve the effect of improving the performance of the microphone, simplifying the chip mounting process, and improving the effect significantly
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[0034] A preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. However, the scope of protection of the present invention is not limited to the following examples, that is, any simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the description are still within the scope of the patent of the present invention.
[0035] refer to Figure 1-6 , is the manufacture method of the MEMS microphone carrier plate of a kind of porous sound-inlet single-hole sound transmission of the present invention, comprises the following steps:
[0036] Step 1, prepare an embedded capacitor substrate 1, the embedded capacitor substrate includes a capacitor layer 11 and a conductive copper foil layer 12 located outside the two sides of the capacitor layer 11, and the two layers of conductive copper foil layers respectively form the second circuit layer L2 and the t...
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