A method for manufacturing an MEMS microphone support plate with porous sound inlet and single-hole sound transmission

Abstract

The invention discloses a method for manufacturing an MEMS microphone support plate with porous sound inlet and single-hole sound transmission, and the method can omit a traditional microphone mounting process for realizing the cavity expansion of a sound transmission path through the chip mounting through a hole steel sheet through the design of embedding a sound cavity in the support plate, thereby simplifying the chip mounting process, and reducing the cost investment. Through the design of embedding the sound cavity in the support plate, the sound transmission sound cavity with high variability is formed in the sound path of the microphone, which is conducive to improving the frequency response and improving the performance of the microphone. Through the miniature porous design of thesound inlet sound hole, the sound inlet volume can be ensured, the dustproof effect is achieved, the butt joint with the chip through the single sound transmission hole in the embedded sound cavity isachieved, and the sound transmission performance of the microphone can be greatly improved; And the single-process production process is mature, the production cost investment is low, the improvementeffect is remarkable, and the performance of terminal products is improved.

Description

Technical field [0001] The invention relates to a manufacturing method of a MEMS microphone carrier board, in particular to a manufacturing method of a MEMS microphone carrier board with porous sound-inlet single-hole sound transmission. Background technique [0002] The finished MEMS microphone carrier board is a conventional single-hole sound-into-single-hole sound transmission design. If a part of the acoustic cavity space in the sound transmission path needs to be changed, a steel sheet with a hole must be added between the sound transmission sound hole and the chip, so the finished MEMS will be added. The overall thickness of the microphone is also limited by the size of the sound port of the chip. The size of the opening of the steel sheet and the space of the cavity formed are limited, and the sound inlet hole cannot be too large, which will affect the dustproof effect. Therefore, this method limits the transmission of the MEMS microphone. Room for improvement of sound per...

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Problems solved by technology

[0002] The finished MEMS microphone carrier board is a conventional single-hole sound-input and single-hole sound-transmission design. If it is necessary to realize the change of part of the sound cavity space in the sound transmission path, it is necessary to add a steel sheet with holes between the sound transmission sound hole and the chip, so it will increase the number of finished MEMS. The overall thickness of the microphone is also limited by the size of the sound transmission port of the chip. The size of the opening of the steel sheet and the space formed by the cavity are limited, and the sound inlet sound hole cannot be too large to affect the dustproof effect. Therefore, this method limits the transmission of the MEMS microphone. Room for improvement in sound performance

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