37results about How to "Simplify the placement process" patented technology

The invention relates to a fabricating method of a touch circuit two-sided graph structure, which comprises the steps of: providing a substrate with a first conducting base material layer and a second conducting base material layer distributed on two sides of the substrate, contacting with a shielding layer for shielding ultraviolet on the top face of the first conducting base material layer; contacting with a first light resistance layer on the top face of the shielding layer, contacting with a second light resistance layer on the bottom face of the second conducting base material layer; exposing the first light resistance layer and the second light resistance layer, shielding ultraviolet on two sides of the substrate through the shielding layer; developing two sides of the substrate to ensure that the first conducting base material layer and the second conducting base material layer respectively expose regions to be etched; and etching the exposed regions of the first conducting base material layer and the second conducting base material layer to ensure that the first conducting base material layer forms a first conducting film of the touch circuit and the second conducting base material layer forms a second conducting film of the touch circuit. Therefore, the invention can simultaneously expose, develop and etch two sides of the substrate so as to simplify the layout procedure of the touch circuit.

The invention discloses a data resource pre-scheduling method based on an edge computing environment. According to the method, in an edge computing environment, preprocessing the obtained data throughan intelligent router or a base station; the edge server schedules and integrates the preprocessed data; relaxation adjustment is carried out on data based on a task generated by a terminal, a data node support degree and a task node dependency degree are calculated in combination with a data correlation degree, data placement and task scheduling are simplified by utilizing the data node supportdegree and the task node dependency degree, and the consistency of data among multiple edge nodes is maintained through a Raft algorithm. Meanwhile, related tasks obtained from a cloud center depend on historical data of data request frequency, a cuckoo algorithm is used for continuously optimizing a scheduling model, and pre-scheduling of data resources in an edge computing environment is achieved.

This invention discloses a method for splicing PCB including the following steps: a, imaging a small sized top graph of a PCB, b, splicing a small sized bottom graph of the PCB with the image got in step a to a large sized top graph image of the PCB, c, taking the image got from step b as the bottom graph of said PCB, which greatly simplifies surface adhering technical flow of PCB to increase production rate and reduce cost of production.

The present invention provides a technology and equipment for simplifying a short circuit ring set in the manufacture of the motor stator, an stator conveyer, a short circuit ring forming device, a coiled silicon steel sheet striking gear, a short circuit ring insertion device, a short circuit ring detection device, a short circuit ring bending device concentrate on the same station, and mounted near the short circuit ring welding device, the short circuit ring forming, insertion stator, detection, bending and welding processes are continuously executed under the control of the ring of the process automatic control device, the task which completes by four to five workers can achieved only by one worker, simplifying the short circuit ring place process of the stator production, saving the processing time, improving the production efficiency, effectively overcoming the problems of fussy process, large working quantity and lower production efficiency when placing the short circuit ring under the production of stator which presents in the traditional process.

A synchronizer ring for a synchronizer of a switchable gear changing transmission, includes a ring body having a synchronizer ring axis, which ring body has an inner friction surface and an outer installation surface, wherein the inner friction surface and the outer installation surface bound the ring body as jacket surfaces. The ring body has an end face and a gear surface opposite the end face, wherein the synchronizer ring has a width (15) which corresponds to the shortest distance between the end face and the gear surface and the jacket surfaces extend between the end face and the gear surface, wherein the ring body has a toothed arrangement which extends radially outwardly from the outer installation surface, wherein the toothed arrangement has a crown gear which extends from the gear surface via a part of the width of the ring body in the direction of the end face, characterized by a recess which is arranged at the inner friction surface of the ring body, so that the radius of the inner friction surface in the region of the recess is larger than the radius of the inner friction surface; at the end face, and wherein a bulge is provided at the outer installation surface which is arranged in the radial direction over the recess.

The invention discloses a bulk material feeding method and device for a chip mounter. The device comprises a cycle conveying belt, a material box, a working position, a first barcode scanner and a second barcode scanner, wherein the first barcode scanner and the second barcode scanner are arranged at one side of the cycle conveying belt, a positioning device, a transmission device and a material separation device are arranged on the working position, the material separation device is used for vibrating upwards and downwards or in a left-right direction, and the transmission device and the positioning device are connected onto the material separation mechanism. By the structure, rapid surface mounting of a bulk material in an assembly line is achieved, the re-braiding process is prevented, the surface mounting process is simplified, the surface mounting efficiency is improved, the surface mounting of various components in a few amount after verification is facilitated, and the automatic surface mounting demand of the bulk material in war industry and research units is satisfied.

The invention discloses a method for manufacturing an MEMS microphone support plate with porous sound inlet and single-hole sound transmission, and the method can omit a traditional microphone mounting process for realizing the cavity expansion of a sound transmission path through the chip mounting through a hole steel sheet through the design of embedding a sound cavity in the support plate, thereby simplifying the chip mounting process, and reducing the cost investment. Through the design of embedding the sound cavity in the support plate, the sound transmission sound cavity with high variability is formed in the sound path of the microphone, which is conducive to improving the frequency response and improving the performance of the microphone. Through the miniature porous design of thesound inlet sound hole, the sound inlet volume can be ensured, the dustproof effect is achieved, the butt joint with the chip through the single sound transmission hole in the embedded sound cavity isachieved, and the sound transmission performance of the microphone can be greatly improved; And the single-process production process is mature, the production cost investment is low, the improvementeffect is remarkable, and the performance of terminal products is improved.

The invention relates to a power supply-free tray type cold chain heat preservation box capable of achieving repeated cold charging, and the power supply-free tray type cold chain heat preservation box capable of achieving the repeated cold charging solves the problems that an existing cold chain heat preservation box is insufficient in heat preservation time, inconvenient to operate and low in effective available space of the heat preservation box. The cold chain heat preservation box comprises an outer box body and an inner box body arranged in the outer box body, and the outer box body is made of heat insulation plates; a heat preservation cage formed by butt joint of heat preservation pipes is arranged between the inner box body and the outer box body, an opening is formed in the frontside of the heat preservation cage, and the heat preservation pipes are arranged on the upper side, the lower side, the left side, the right side and the back side of the heat preservation cage; an input port of a heat preservation medium is arranged at one corner of the bottom of the heat preservation cage, and an output port of the heat preservation medium is arranged at the opposite angle of the top of the heat preservation cage; and an integrated box door is arranged on the front sides of the inner box body and the outer box body, and the heat preservation pipes capable of achieving the heat preservation medium charging and discharging is embedded into the box door. According to the power supply-free tray type cold chain heat preservation box capable of achieving the repeated cold charging, the heat preservation is carried out through the heat preservation cage formed of the heating pipes capable of achieving the repeated cold charging, the endurance time of the cold chain heat preservation is prolonged, the holding and replacing operations of the heat preservation media are simplified, and the space effective utilization rate of the heat preservation box is improved.

The embodiments of the invention provide a manufacturing method of a multilayer circuit board, a multilayer circuit board and electronic equipment. The manufacturing method of the multilayer circuit board comprises the following steps that: a first circuit board and a second circuit board are provided, wherein the first circuit board has a preset thickness; an accommodating cavity is formed in thechip mounting area of the first circuit board, so that a first circuit board with a connecting part can be formed, the depth of the accommodating cavity is smaller than the thickness of the first circuit board; and the connecting part of the first circuit board and the second circuit board are stacked so as to form the multilayer circuit board, the opening direction of the accommodating cavity faces the second circuit board, and the accommodating cavity is used for accommodating components which are installed on the second circuit board and face the first circuit board. With the manufacturingmethod of the multilayer circuit board, the multilayer circuit board and the electronic equipment of the invention adopted, a chip mounting process and a welding process can be simplified, the welding reject ratio of products is reduced, cost is reduced, and production efficiency is improved.

The invention relates to the field of optical devices, in particular to a design of a 10G miniaturized EML laser heat sink. The invention provides the 10G miniaturized EML laser heat sink, which comprises a silicon substrate, wherein a backlight monitoring assembly placement groove, a V-shaped notch, a bonding pad, a high-frequency transmission line and a thin-film circuit are arranged in/on the silicon substrate; the backlight monitoring assembly placement groove is positioned in a rear position of a laser chip; the V-shaped notch is used for holding a lens, and is positioned in a right ahead position of the laser chip; the bonding pad is used as a preserved bonding pad for gold wire binding; the thin-film circuit is used for regulating the high-frequency performance of the laser chip. The design of the laser heat sink has the advantages that on the basis of guaranteeing the total electric performance of the laser, the existing EML laser heat sink is optimized; a process encapsulation platform is favorably simplified; the attaching mounting work procedure with multiple materials and complicated process is simplified; the design belongs to a heat sink design scheme with the advantages of exquisite and ingenious structure, obvious effect, simple process and low cost.

The invention discloses a tool and a method for mounting a chip in a gel box in a nondestructive manner by a manual dispensing chip mounter. The tool comprises an objective table, a vacuum adsorptiontable located at one corner of the objective table and a supporting table located on a bottom surface of the objective table. The vacuum adsorption table is provided with a threaded straight-through pipe which penetrates through the objective table and extends to the back surface of the objective table, and the vacuum adsorption table is used for adsorbing the gel box. Compared with an existing method of clamping the chip from the gel box into an object carrying box and then carrying out mounting, the method has advantages that a self-made chip mounting tool is utilized; the chip is directly picked up from the gel box to be mounted; a process that tweezers are used for picking up the chip from the gel box to the object carrying box and then mounting is performed is replaced; and chip damage possibly caused in a chip picking-up process is avoided, production cost is reduced, a chip mounting process is simplified, operation is convenient, and production efficiency is greatly improved.

The invention relates to a medical image scanning system and a positioning method thereof. The medical image scanning system comprises a scanning apparatus located in a shielded room, a scanning bed located in the shielded room, and scanning control equipment located outside the shielded room, wherein the scanning apparatus is provided with a scanning cavity, the scanning bed moves along the scanning cavity, the scanning control equipment is connected with the scanning apparatus and is provided with a storage module, the storage module stores a relationship between a scanning site and a scanning start position and a relationship between a scanning body position and the scanning start position, and the scanning control equipment is used to adaptively match to the scanning start position ofthe scanning bed according to the scanning site and the scanning body position, so that a user can use the scanning control equipment to realize positioning of the medical image scanning system outside the shielded room, the user is prevented from radiation, the convenience and safety of positioning of the medical image scanning system are improved, and the hardware cost of the medical image scanning system is reduced.

The invention relates to a module power supply packaging and adhesive filling method. The method comprises the following steps of: step 1, placing a printed circuit board in a groove of a packaging mold, and exposing a pin of the printed circuit board outside the groove; 2, pouring a liquid pouring sealant into the groove, and carrying out liquid enveloping on the printed circuit board; and 3, heating the pouring sealant, and taking out the printed circuit board from the packaging mold after the pouring sealant is cured. According to the method, a shell of a module power supply is removed, and therefore, the material cost is reduced, the process of placing the printed circuit board in the shell is simplified, and the production efficiency is improved.

The invention relates to a centrifugal pendulum device (2) having a rotatable pendulum bracket (18) and at least one pendulum weight (20) arranged on the pendulum bracket. The pendulum weight moves between two final positions relative to the pendulum bracket (18) through at least one guide element (46, 48) (which extends in a guide slot (50, 52) between the pendulum bracket (18) and the pendulum weight (20)). A damper element (54) is attached to the pendulum bracket (18). By the damper element (54), the pendulum weight (20) supports or is supported on the pendulum bracket (18) before reaching one of the final positions (preferably two final positions). The damper element (54) is arranged in a groove (56) of the pendulum bracket (18). In addition, the invention also relates to a torsion damper provided with the centrifugal pendulum device.

The invention discloses a splicing, butt joint and in-place method of large floating mats in natural rivers. The method comprises the following steps that a processing site is arranged on a river bankclose to an installation position of floating mats; segmented floating mats are assembled on slide way steel pipes of the processing site; after machining of one segmented floating mat is completed,the segmented floating mats slide into a water surface along the sliding ways and are connected with anchor rings pre-buried on a shore till that machining of all the segmented floating mats is completed; all the segmented floating mats are launched in sequence, and the multiple segmented floating mats are spliced and combined into an integrated large floating mat under traction of a barge; and connection between a connecting device and the large floating mat is completed on the water surface, and in-place of the large floating mat is completed. The integral large floating mat is finally formed by processing, launching and connecting the segmented floating mats so that a requirement on a processing site area of the floating mat can be reduced, and the processing, launching and positioningof the floating mat can be simplified, and a construction period is shortened.

The invention discloses a simple and accurate positioning device and method for pre-burying and trepanning a pay-off hole. The device is composed of two parts; the upper part comprises an inverted double-circular-truncated-cone-shaped laser projection cylinder, the inverted double-circular-truncated-cone-shaped laser projection cylinder is of a structure with an upper layer and a lower layer, the upper layer is cylindrical, the lower layer is circular-truncated-cone-shaped, the upper layer is hollow and is provided with an infrared laser projection head and a battery, and a level bubble is embedded in the circular-truncated-cone-shaped surface of the lower layer; and the lower part is a cylindrical double-ring-shaped leveling base which is provided with an adjusting bolt. The device can be repeatedly used, and is simple to manufacture, easy to operate and high in precision, so that the construction operation time is shortened, and the number of operators is reduced. Compared with a conventional plumb bob instrument for plumbing, the pay-off construction efficiency is improved, the construction investment is reduced, and good economic benefits and social benefits are generated.