Bulk material feeding method and device for chip mounter

Abstract

The invention discloses a bulk material feeding method and device for a chip mounter. The device comprises a cycle conveying belt, a material box, a working position, a first barcode scanner and a second barcode scanner, wherein the first barcode scanner and the second barcode scanner are arranged at one side of the cycle conveying belt, a positioning device, a transmission device and a material separation device are arranged on the working position, the material separation device is used for vibrating upwards and downwards or in a left-right direction, and the transmission device and the positioning device are connected onto the material separation mechanism. By the structure, rapid surface mounting of a bulk material in an assembly line is achieved, the re-braiding process is prevented, the surface mounting process is simplified, the surface mounting efficiency is improved, the surface mounting of various components in a few amount after verification is facilitated, and the automatic surface mounting demand of the bulk material in war industry and research units is satisfied.

Description

technical field [0001] The invention relates to an auxiliary equipment for a placement machine, in particular to a method and a device for feeding bulk materials that can be used in conjunction with a placement machine, and belongs to the field of electronic placement equipment. Background technique [0002] In the field of electronic placement technology, the placement of electronic components is a process with high technical content and complicated operations. The placement machine is a kind of main equipment to complete this kind of work. When the placement machine is working, use the computer-aided control system and the corresponding positioning system to accurately position the placement head, and automatically pick up the electronic components on the automatic feeder through the suction pen on the placement head, and then drive the placement through the transmission system The head accurately mounts the electronic components to the corresponding position of the tar...

AI Technical Summary

Problems solved by technology

[0004] The existing bulk material placement mainly adopts manual placement, which has low efficiency and unstable quality. With the shrinking size of electronic components and the increase in types and quantities, the manual placement process of such electronic components is becoming more and more difficult. It can't even meet the production needs, and its disadvantages are constantly emerging

Another bulk material mounting method is to reassemble the inspected bulk material onto the tape, install the tape into the automatic feeder, and then use the placement machine and the automatic feeder to complete the automatic mounting. The process is cumbersome and the operation is complicated. Although it can improve the placement efficiency and placement accuracy, it takes a long time to prepare. At the same time, if the number of product components is small, the input and output of braiding are out of proportion, and the actual effect when it is put into production poor

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