Module power supply packaging and adhesive filling method

A module power supply and filling technology, applied in electrical components, printed circuits, printed circuit manufacturing and other directions, can solve problems affecting packaging efficiency, increase packaging processes, increase material costs, etc., to simplify the placement process and improve production. Efficiency, material cost reduction effect

Inactive Publication Date: 2021-08-13
广州市爱浦电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the present invention solves the problem that the module power supply packaging method in the prior art needs to make a special casing assembly, install the printed circuit board in the casing, increase the packaging process, affect the packaging efficiency, and increase the material cost.

Method used

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  • Module power supply packaging and adhesive filling method
  • Module power supply packaging and adhesive filling method
  • Module power supply packaging and adhesive filling method

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Embodiment Construction

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0035] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

[0036]It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationsh...

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Abstract

The invention relates to a module power supply packaging and adhesive filling method. The method comprises the following steps of: step 1, placing a printed circuit board in a groove of a packaging mold, and exposing a pin of the printed circuit board outside the groove; 2, pouring a liquid pouring sealant into the groove, and carrying out liquid enveloping on the printed circuit board; and 3, heating the pouring sealant, and taking out the printed circuit board from the packaging mold after the pouring sealant is cured. According to the method, a shell of a module power supply is removed, and therefore, the material cost is reduced, the process of placing the printed circuit board in the shell is simplified, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of module power supplies, and in particular relates to a method for encapsulating and potting a module power supply with glue. Background technique [0002] The power module is a power supply that can be directly mounted on the printed circuit board, and its characteristic is that it can provide power for application-specific integrated circuits, digital signal processors, microprocessors, memories, field programmable gate arrays) and other digital or analog loads. powered by. Generally, such modules are called point-of-load power supply systems or point-of-use power supply systems. Due to the many advantages of the modular structure, the module power supply is widely used in communication fields such as switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers, automotive electronics, aerospace, etc. The traditional chip micropower power supply str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K3/284H05K2203/1327
Inventor 李绍兵韦辉
Owner 广州市爱浦电子科技有限公司
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