Tool and method for mounting chip in gel box in nondestructive manner by manual dispensing chip mounter

Abstract

The invention discloses a tool and a method for mounting a chip in a gel box in a nondestructive manner by a manual dispensing chip mounter. The tool comprises an objective table, a vacuum adsorptiontable located at one corner of the objective table and a supporting table located on a bottom surface of the objective table. The vacuum adsorption table is provided with a threaded straight-through pipe which penetrates through the objective table and extends to the back surface of the objective table, and the vacuum adsorption table is used for adsorbing the gel box. Compared with an existing method of clamping the chip from the gel box into an object carrying box and then carrying out mounting, the method has advantages that a self-made chip mounting tool is utilized; the chip is directly picked up from the gel box to be mounted; a process that tweezers are used for picking up the chip from the gel box to the object carrying box and then mounting is performed is replaced; and chip damage possibly caused in a chip picking-up process is avoided, production cost is reduced, a chip mounting process is simplified, operation is convenient, and production efficiency is greatly improved.

Description

technical field [0001] The invention relates to a chip mounting method, in particular to a gel box-packed chip mounting method. Background technique [0002] A typical microwave component contains dozens or even hundreds of chips, among which expensive and complex chips, such as modulator chips, sensor chips, etc., are packed in gel boxes to avoid damage caused by chip collisions and affect The performance is even directly scrapped. [0003] The gel box has a certain degree of stickiness, and the manual dispensing and placement machine cannot directly pick up the chips in it. Therefore, it is generally necessary to use tweezers to pick up the chips in the gel box into the loading box before manual placement, and then Mounting is very easy to cause damage such as edge chipping of the chip during chip clamping, resulting in increased production costs. [0004] Some chips need to be specially customized, and their wear and tear will even affect the delivery schedule of the pr...

AI Technical Summary

Problems solved by technology

[0002] A typical microwave component contains dozens or even hundreds of chips, among which expensive and complex chips, such as modulator chips, sensor chips, etc., are packed in gel boxes to avoid damage caused by chip collisions and affect Performance or even directly scrapped

[0003] The gel box has a certain degree of stickiness, and the manual dispensing and placement machine cannot directly pick up the chips in it. Therefore, it is generally necessary to use tweezers to pick up the chips in the gel box into the loading box before manual placement, and then Mounting is very easy to cause chip chipping and other damage during chip clamping, resulting in increased production costs

[0004] Some chips need to be specially customized, and their loss will even affect the delivery schedule of the product, so it is very meaningful to use a simple, convenient and non-destructive method of manually mounting the chips in the gel box

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