Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment

A technology for multilayer circuit boards and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, and structural connection of printed circuits, etc., and can solve problems such as high equipment and labor costs, and long chip manufacturing process

Inactive Publication Date: 2019-12-27
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the entire SMT process is long

Method used

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  • Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment
  • Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment
  • Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment

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Embodiment Construction

[0020] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0021] It can be understood that the terms "first", "second" and the like used in this application may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first set of circuit boards could be termed a second set of circuit boards, and, similarly, a second set of circuit boards could be termed a first set of circuit boards, without departing from the scope of the present application. Both the first group of circuit boards and the second grou...

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Abstract

The embodiments of the invention provide a manufacturing method of a multilayer circuit board, a multilayer circuit board and electronic equipment. The manufacturing method of the multilayer circuit board comprises the following steps that: a first circuit board and a second circuit board are provided, wherein the first circuit board has a preset thickness; an accommodating cavity is formed in thechip mounting area of the first circuit board, so that a first circuit board with a connecting part can be formed, the depth of the accommodating cavity is smaller than the thickness of the first circuit board; and the connecting part of the first circuit board and the second circuit board are stacked so as to form the multilayer circuit board, the opening direction of the accommodating cavity faces the second circuit board, and the accommodating cavity is used for accommodating components which are installed on the second circuit board and face the first circuit board. With the manufacturingmethod of the multilayer circuit board, the multilayer circuit board and the electronic equipment of the invention adopted, a chip mounting process and a welding process can be simplified, the welding reject ratio of products is reduced, cost is reduced, and production efficiency is improved.

Description

technical field [0001] The present application relates to the technical field of circuit boards, in particular to a method for manufacturing a multilayer circuit board, a multilayer circuit board and electronic equipment. Background technique [0002] Electronic devices are playing an increasingly important role in people's lives. Users have higher and higher performance requirements for electronic devices such as smart phones and tablet computers, and more and more devices need to be placed on the circuit boards of electronic devices. [0003] Considering the layout density and space of components, the electronic equipment stacked board process realizes the 3D layout of components to place more devices. Currently, a laminated board based on Surface Mounting Technology (SMT) is composed of an upper board, a middle frame connecting board and a lower board. Generally, the upper board, the middle frame connecting board and the lower board can be welded together in different or...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/14
CPCH05K1/144H05K1/145H05K3/4611
Inventor 何蔼廷
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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