Novel computer host radiator with an improved structure

A computer and heat sink technology, which is applied in the field of computer mainframe heat sinks, can solve the problems of low heat dissipation efficiency, unreasonable heat sink structure design, and lack of dustproof function, etc., so as to improve heat dissipation efficiency, improve efficiency, The effect of air movement

Inactive Publication Date: 2019-06-11
徐宏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are some deficiencies in the existing computer host radiators during use. The structural design of the radiator is unreasonable, the efficiency of heat dissipation is low, and secondly, it does not have the effect of dustproof.

Method used

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  • Novel computer host radiator with an improved structure
  • Novel computer host radiator with an improved structure

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0021] refer to Figure 1-2 , a new improved structure computer host radiator, including a main board 1 and a heat sink 3, a heat conduction fin 2 is fixed at the center of the front surface of the main board 1, and a heat sink 3 is fixed on the heat conduction fin 2 equidistantly, and the front surface of the heat sink 3 A first heat dissipation fan 4 and a second heat dissipation fan 6 are sequentially arranged from right to left along the horizontal direction, and a fan blade 5 is arranged inside the first heat dissipation fan 4, and a heat dissipation plate 9 is arranged above the heat dissipation fin 3, and the heat dissipation plate 9 passes through The liquid ...

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Abstract

The invention discloses a novel computer host radiator with an improved structure. The radiator comprises a main board and radiating fins, A heat conduction sheet is fixed to the center of the front surface of the main board, cooling fins are fixed to the heat conduction sheet at equal intervals, a first cooling fan and a second cooling fan are sequentially arranged on the front surface of each cooling fin from right to left in the horizontal direction, a cooling plate is arranged above the cooling fins, and the cooling plates are fixedly connected with a water cooling box through liquid conveying pipes. According to the invention, the device has the following advantages, Firstly, two cooling fans are arranged on the front surface of a stacked cooling fin; air flow between the radiating fins can be accelerated; the heat dissipation efficiency is effectively improved; secondly, the upper side and the lower side of the contact position of the cooling fin and the heat conduction fin are provided with the cooling plates connected with the water cooling box through the liquid transmission pipes to form water cooling heat dissipation, so that the novel computer mainframe radiator with the improved structure effectively combines the cooling fin, the cooling fan and the water cooling radiator, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a computer host radiator with a new and improved structure. Background technique [0002] High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The role of the radiator is to absorb the heat and then radiate it to the inside or outside of the chassis to ensure that the temperature of the computer components is normal. Heat sinks are required, and these different heat sinks cannot be mixed, and the one we most often come into contact with is the CPU heat sink. According to the way heat is taken away from the radiator, the radiator can be divided into active cooling and passive cooling. The former is common for air-cooled radiators, while the latter is common for heat sinks. Further subdividing heat dissipation methods can be divided into air c...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 徐宏
Owner 徐宏
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