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A design process for retaining half-holes on the sides of tiny copper-plated holes

A design process, copper-plated hole technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of small copper-plating area, high defect rate, tin eating, etc., to ensure copper-plating residue, improve yield, and reduce scrap. Effect

Active Publication Date: 2021-07-20
高德(江苏)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of process is aimed at the production of tiny copper plating holes, which has a high defect rate, and when it is etched, due to the influence of side etching, the residual copper plating area is smaller, resulting in poor tin eating

Method used

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  • A design process for retaining half-holes on the sides of tiny copper-plated holes
  • A design process for retaining half-holes on the sides of tiny copper-plated holes
  • A design process for retaining half-holes on the sides of tiny copper-plated holes

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Embodiment Construction

[0021] Below the present invention will be further described in conjunction with the embodiment in the accompanying drawing:

[0022] Such as Figure 1-5 As shown, a kind of tiny copper-plated hole side of the present invention retains half-hole design process, comprises the following steps:

[0023] (1) Design data: First of all, at the front end of data design, it is necessary to design the copper-plated hole on the edge of the board, and the position of the hole to be removed should be designed as a ring-free design, so as to solve the problem of copper warping caused when the copper-plated waste hole is removed in the final molding. abnormal;

[0024] (2) Negative film collection: In the data design, the copper-plated waste edge adopts a ringless design, so a special negative film needs to be made; that is, in the negative film, the copper-plated hole on the edge of the board is half of the copper-plated hole to retain the ring design required by the customer. The other ...

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Abstract

The invention relates to a design process of retaining a half-hole on the side of a tiny copper-plated hole. After cutting the traditional pre-etching preform into a half-hole in the industry, the edge of the etching copper is lifted, and then the final shape process is performed, and the final shape is changed to a half-hole cutting. , Cancel the pre-forming process before etching, in order to improve the process capability, reduce the production process, and solve the problem of insufficient hole wall residue caused by half-hole offset and side etching, which leads to poor tin intake when punching parts. Improve the overall yield of the board factory.

Description

technical field [0001] The invention relates to the technical fields of PCB board preparation and communication semiconductors, in particular to a design process for retaining a half-hole on the side of a tiny copper-plated hole. Background technique [0002] With the development of science and technology, the progress of society and the improvement of people's living standards, communication electronics has become an indispensable electronic device for people. The popularization of domestic 3G4G communication, and the upcoming 5G communication, and the corresponding communication quality chips have become one of the main performances that directly affect a communication electronic product. It is also an important indicator to evaluate the quality of electronic products. In communication-related equipment, the chip is the heart of the equipment, which directly affects the performance of the equipment. For normal chips, the industry uses IC substrates as the carrier. Such s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/42
Inventor 王留刚
Owner 高德(江苏)电子科技股份有限公司