Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method for transferring semiconductor chips and transfer tool

A semiconductor and tool technology, applied in the field of transferring semiconductor chips and transfer tools, can solve the problem of time consumption and save time.

Active Publication Date: 2019-06-18
OSRAM OPTO SEMICON GMBH & CO OHG
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is associated with a considerable expenditure of time, especially when producing devices with a plurality of semiconductor chips

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for transferring semiconductor chips and transfer tool
  • Method for transferring semiconductor chips and transfer tool
  • Method for transferring semiconductor chips and transfer tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0080] figure 1 A cutaway schematic side view of a portion of transfer tool 100 is shown. The transfer tool 100 is provided for transferring semiconductor chips selectively and in parallel from a source carrier to a target carrier. The transfer tool 100 here enables simultaneous and parallel transfer of a plurality of semiconductor chips. Furthermore, the transfer tool 100 makes it possible not to transfer all semiconductor chips present on the source carrier, but to selectively select the semiconductor chips to be transferred.

[0081] also, figure 1 A cutaway schematic side view of a portion of source carrier 400 is shown. A semiconductor chip 500 is arranged on the upper side 401 of the source carrier 400 . The semiconductor chips 500 may be present in a regular one-dimensional or two-dimensional arrangement, for example in a two-dimensional matrix arrangement. In this case, all grid positions of the regular arrangement can be occupied by the semiconductor chip 500 . ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for transferring semiconductor chips comprises steps: providing a transfer tool having a plurality of segments, wherein each segment has a liquid receptacle region; providing a plurality of semiconductor chips in a regular arrangement on a source carrier; providing a target carrier; selectively arranging liquid drops at the liquid receptacle regions of at least some of the segments; bringing the transfer tool near to the source carrier, wherein each liquid drop makes contact with a semiconductor chip and wets the latter; lifting off the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted off with the transfer tool from the source carrier; bringing the transfer tool near to the target carrier, wherein the semiconductor chips arrangedon the transfer tool make contact with the target carrier; and lifting off the transfer tool from the target carrier, wherein the semiconductor chips that made contact with the target carrier remainon the target carrier.

Description

technical field [0001] The invention relates to a method for transferring semiconductor chips and a transfer tool for transferring semiconductor chips. Background technique [0002] Various methods are known from the prior art for transferring semiconductor chips from a source carrier to a target carrier. Conventionally, the semiconductor chips are transferred here individually one after the other. This is associated with a considerable expenditure of time, especially when producing devices with a plurality of semiconductor chips. Therefore, of interest are methods and apparatus for concurrently transferring multiple semiconductor chips in parallel. US 2014 / 0061687 A1 describes such a method and such a device. In this case, the semiconductor chip is held on the transfer tool by electrostatic forces for transfer. Contents of the invention [0003] The object of the invention is to propose a method for transferring semiconductor chips. Another object of the present inve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/00H01L21/67H01L23/00H05K13/04
CPCH01L2224/75303H01L21/67144H01L24/75H01L24/83H01L33/0095H01L2224/291H01L2224/2919H01L2224/32225H01L2224/7565H01L2224/83192H01L2224/95001H01L2224/95136H01L2224/97H01L2224/7598H01L2224/95146H01L24/97H01L2224/83H01L2924/014H01L2924/00014B65G47/90H01L21/6836H01L24/29H01L24/32
Inventor 托马斯·施瓦茨于尔根·莫斯布格尔弗兰克·辛格
Owner OSRAM OPTO SEMICON GMBH & CO OHG
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com