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Laser cutting method

A laser cutting and scanning area technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of low efficiency of board splitting and low cutting precision, and achieve improved cutting precision, improved scanning efficiency, and improved scanning The effect of precision

Inactive Publication Date: 2019-06-21
HANS CNC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, these connectors are positioned one by one and then cut off, but it is found in practice that the existing cutting method has low cutting precision and low efficiency of board separation

Method used

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Embodiment Construction

[0034] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the understanding of the present disclosure will be better and more complete.

[0035] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The t...

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Abstract

The invention relates to a laser cutting method. The laser cutting method comprises the following steps that workpieces are provided, the workpieces comprises plate bodies and a plurality of plate units, wherein the plate units are arranged on the plate body, each plate unit comprises a single plate and a connecting piece, the single plates and the plate bodies are arranged at intervals to form hollow areas between the single plates and the plate bodies, and connecting pieces are connected with the single plates and the plate bodies; the workpieces are divided into a plurality of scanning areas, and each scanning area comprises a plurality of plate units; a scanning path is planned, and the scanning path is successively connected with all scanning areas; the scanning areas are scanned oneby one along the scanning path, and when each scanning area is scanned, the image of an integrated scanning area is obtained at one time; the position coordinates of all connecting pieces in the imageof the scanning areas are analyzed; and the connecting pieces are cut according to the position coordinates, so that the single plates and the plate bodies are separated. The laser cutting method hasthe advantages that the cutting precision is high, and the plate separation efficiency is high.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a laser cutting method. Background technique [0002] In the surface mount technology process, in order to improve work efficiency, several PCBA veneers will be made into a whole imposition. In this way, when picking and placing materials at one time, picking and placing one imposition is equivalent to picking and placing multiple PCBA single boards, which saves the time for picking and placing PCBA single boards and improves work efficiency. [0003] The PCBA veneer is made through the following steps. First, several PCBA veneer shapes are formed by punching on a complete board. After punching, these PCBA veneers are connected by connectors. Die-cut part. Then these connectors are cut by cutting, so that the interconnected PCBA veneers are separated. [0004] At present, these connecting parts are positioned one by one and then cut off, but it is found in practice that ...

Claims

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Application Information

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IPC IPC(8): B23K26/082
Inventor 谢大维范永闯杨凯吕洪杰翟学涛高云峰
Owner HANS CNC SCI & TECH
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