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TFT panel and testing method

A test method and panel technology, applied in semiconductor/solid-state device test/measurement, electrical measurement, measurement device, etc., can solve the problems of high material cost and production capacity cost, high test fixture requirements, low test success rate, etc. The effect of reducing material cost and production capacity cost and improving test success rate

Active Publication Date: 2019-06-21
SHANGHAI IRAY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a TFT panel and a testing method, which are used to solve the problem of high requirements for testing equipment and test fixtures in the testing of TFT panels before going online in the prior art. Low test success rate, high material cost and high production cost

Method used

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  • TFT panel and testing method
  • TFT panel and testing method

Examples

Experimental program
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Effect test

Embodiment 1

[0034] This embodiment provides a TFT panel, and the TFT panel includes:

[0035] m×n bonding pads, wherein both m and n are natural numbers greater than or equal to 1, and the m×n bonding pads are correspondingly arranged and electrically connected to the TFT units in the TFT active area;

[0036] TFT test area, the TFT test area includes m drive pads, n test pads and m×n TFT devices, wherein the m×n TFT devices are divided into n groups, and each group includes m For the TFT devices, the m TFT devices in each group are respectively electrically connected to the m driving pads and the m bonding pads, and the m TFT devices in each group are connected to n One of the test pads is electrically connected to one of the test pads.

[0037] In the TFT panel in this embodiment, by integrating a TFT test area including m drive pads, n test pads and m×n TFT devices on the TFT panel, the pad spacing required for testing is increased, thereby Reduce the requirements for test equipment ...

Embodiment 2

[0048] Such as figure 2 As shown, in order to further explain the solution of the present invention, this embodiment also provides another TFT panel. Compared with Embodiment 1, the difference is that the bonding pad 110 in this embodiment is located on the driving side of the TFT panel Bonding pads, it is only necessary to convert the high-precision reading-side bonding pads in Embodiment 1 into driving-side bonding pads in the TFT panel, wherein the function of the bonding pads is determined by Read becomes drive, which is still controlled by the low-precision drive pad 211 .

[0049] Specifically, in this embodiment, the TFT panel includes: m×n bonding pads 110 and TFT test areas 210 . Where m and n are both natural numbers greater than or equal to 1, and the m×n bonding pads 110 are driving side bonding pads located in the TFT panel, that is, the bonding pads 110 include n g1 ~gm, and corresponding to the TFT unit (not shown) in the TFT effective area; the TFT test area...

Embodiment 3

[0053] Such as image 3 , the present embodiment provides a method for testing a TFT panel, comprising the following steps:

[0054] Provide any one of the above-mentioned TFT panels;

[0055] Through the m driving pads and the n testing pads, respectively perform m tests to obtain the information of the m×n bonding pads; wherein, each test will be related to one of the driving pads The n TFT devices electrically connected to the pads are turned on, and the information of the n bonding pads electrically connected to the n TFT devices that are turned on is obtained through the n test pads.

[0056] Specifically, this embodiment integrates a TFT test area including m drive pads, n test pads, and m×n TFT devices on the TFT panel, so that the number m+n of pads required for testing is smaller than that of the TFT panel The number of bonding pads in m×n, so that the pad spacing required for the test is greater than the bonding pad spacing in the TFT panel; when testing the TFT pa...

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Abstract

The invention provides a TFT panel and a testing method. The TFT panel comprises mXn bonding pads, and a TFT testing region, wherein m and n are natural numbers larger than or equal to 1; the mXn bonding pads are arranged corresponding to and electrically connected with TFT units in an TFT active region; the TFT testing region comprises m driving bonding pads, n testing bonding pads and mXn TFT devices; the mXn TFT devices are divided into n groups; each group comprises m TFT devices; the m TFT devices in each group are electrically connected with the m driving bonding pads and the m bonding pads correspondingly; and the m TFT devices in each group are electrically connected with the same testing bonding pads in the n testing bonding pads. The mXn bonding pads which are pressed once originally are tested for m times, so that high-precision testing is divided into m-time low-precision testing, the requirements on testing equipment are reduced, the testing success rate is improved, and the material cost and the productivity cost are reduced.

Description

technical field [0001] The invention belongs to the field of flat panel detectors, and relates to a TFT panel and a testing method. Background technique [0002] Digital Radio Graphy (DR for short) is a new technology of X-ray photography developed in the 1990s. With its remarkable advantages such as faster imaging speed, more convenient operation, and higher imaging resolution, It has become the leading direction of digital X-ray photography technology and has been recognized by clinical institutions and imaging experts all over the world. [0003] Generally speaking, a flat panel detector is a detector that uses semiconductor technology to convert X-ray energy into electrical signals to generate X-ray images. With the development of society and the advancement of science and technology, X-ray flat panel detectors play an extremely important role in the fields of medical imaging and industrial flaw detection, and one of the core components of X-ray flat panel detectors is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/66
CPCH01L27/124G01R31/2844G01R31/2829G01R31/2621
Inventor 朱翀煜金利波岳欢
Owner SHANGHAI IRAY TECH
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