SoC connecting fpga and artificial intelligence module

A system-on-a-chip, artificial intelligence technology, applied in the field of integrated circuits, can solve problems such as difficulty in adapting to the large bandwidth requirements of AI modules, and achieve the effect of high bandwidth processing capabilities

CN109933370BActive Publication Date: 2021-10-15HERCULES MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2021-10-15

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Abstract

A circuit and a system chip connecting FPGA and artificial intelligence AI module on the system chip. In an embodiment, the system chip includes: an AI module, including a plurality of processing units arranged in a two-dimensional array, and each processing unit can complete logic and / or multiplication and addition operations; an FPGA module; a winding module, used to provide the AI ​​module Coupling of inputs and / or outputs to the FPGA module. When the FPGA and the AI ​​module are integrated on the same chip, the output / input signal of the AI ​​module can find the corresponding FPGA connection point very well. FPGA can provide a large amount of data to the AI ​​module at high speed, with its high bandwidth processing capability.
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Description

technical field

[0001] The invention relates to the technical field of integrated circuits, in particular to a circuit and a system chip for connecting an FPGA and an artificial intelligence module on a system chip. Background technique

[0002] In recent years, artificial intelligence has ushered in a wave of development. Artificial intelligence is the study of making computers to simulate certain thinking processes and intelligent behaviors (such as learning, reasoning, thinking, planning, etc.) Can achieve higher level applications.

[0003] At present, the access control of artificial intelligence AI modules is performed by the processor through the bus, and the bus has a certain bandwidth limitation, such an architecture is difficult to adapt to the large bandwidth requirements of the AI ​​module. SUMMARY OF THE INVENTION

[0004] According to an embodiment of the present invention, a system chip is provided, including: an AI module, including a plurality of process...

Examples

Embodiment Construction

[0013] In order to express the technical solutions and advantages of the embodiments of the present invention more clearly, the technical solutions of the present invention are further described in detail below through the accompanying drawings and embodiments.

[0014] In the description of this application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "east", "south", "west", "north" "," "vertical", "horizontal", "top", "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of description This application and the simplified description do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application.

[0015] figure 1 It is a schematic diagram of...