SoC connecting fpga and artificial intelligence module

A system-on-a-chip, artificial intelligence technology, applied in the field of integrated circuits, can solve problems such as difficulty in adapting to the large bandwidth requirements of AI modules, and achieve the effect of high bandwidth processing capabilities

Active Publication Date: 2021-10-15
HERCULES MICROELECTRONICS CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Currently, the artificial intelligence AI module is accessed by the processor through the bus, and the bus has a certain bandwidth limit. Such an architecture is difficult to meet the large bandwidth requirements of the AI ​​module.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SoC connecting fpga and artificial intelligence module
  • SoC connecting fpga and artificial intelligence module
  • SoC connecting fpga and artificial intelligence module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] In order to express the technical solutions and advantages of the embodiments of the present invention more clearly, the technical solutions of the present invention are further described in detail below through the accompanying drawings and embodiments.

[0014] In the description of this application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "east", "south", "west", "north" "," "vertical", "horizontal", "top", "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of description This application and the simplified description do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application.

[0015] figure 1 It is a schematic diagram of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A circuit and a system chip connecting FPGA and artificial intelligence AI module on the system chip. In an embodiment, the system chip includes: an AI module, including a plurality of processing units arranged in a two-dimensional array, and each processing unit can complete logic and/or multiplication and addition operations; an FPGA module; a winding module, used to provide the AI ​​module Coupling of inputs and/or outputs to the FPGA module. When the FPGA and the AI ​​module are integrated on the same chip, the output/input signal of the AI ​​module can find the corresponding FPGA connection point very well. FPGA can provide a large amount of data to the AI ​​module at high speed, with its high bandwidth processing capability.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a circuit and a system chip for connecting an FPGA and an artificial intelligence module on a system chip. Background technique [0002] In recent years, artificial intelligence has ushered in a wave of development. Artificial intelligence is the study of making computers to simulate certain thinking processes and intelligent behaviors (such as learning, reasoning, thinking, planning, etc.) Can achieve higher level applications. [0003] At present, the access control of artificial intelligence AI modules is performed by the processor through the bus, and the bus has a certain bandwidth limitation, such an architecture is difficult to adapt to the large bandwidth requirements of the AI ​​module. SUMMARY OF THE INVENTION [0004] According to an embodiment of the present invention, a system chip is provided, including: an AI module, including a plurality of process...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F9/38G06F15/78G06F15/173G06N3/063
Inventor 连荣椿王海力马明
Owner HERCULES MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap