Chip nano-silver paste coating device
A nano-silver paste and coating device technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of not being able to meet different types of chips, low coating efficiency, and affecting chip production efficiency, so as to achieve convenient replacement , high coating efficiency, and avoid displacement effect
Active Publication Date: 2019-06-28
HIDETAKA NANO TECH CO LTD
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Problems solved by technology
Nano-silver is usually attached to the chip by coating, but the existing mechanical coating method has the following problems: first, it cannot meet different types and sizes of chips; second, the coating efficiency is low, which affects the production efficiency of the chip
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[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0027] A chip nano-silver paste coating device, including a bottom plate 1, an auxiliary part 7, a first motor 15, a second motor 42, and a limiting part 32;
[0028] The bottom plate 1 is provided with a first supporting column 2, a second supporting column 3, a third supporting column 4, and a fourth supporting column 5, and the first supporting column 2, the second supporting column 3, the third supporting column 4, and the fourth supporting column The columns 5 are distributed clockwise around the central axis of the base plate 1, the first support column 2 and the third support column 4 are distributed diagonally, the second support column 3 and the fourth support column 5 are distributed diagonally; the base plate 1 is provided with a For the track 6, the track 6 is located outside the first support column 2 and the second support column ...
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The invention provides a chip nano-silver paste coating device, which solves the problem that a traditional chip coating device has low coating efficiency and cannot satisfy different types of chips,By a driving wheel, a driven wheel, a first motor, a first cable, a second cable and the like, a first roller and a second roller are rotated. An auxiliary plate moves in the X direction on a track soas to drive a coating wheel to coat a plurality of chips. The chip nano-silver paste coating device has high coating efficiency, can coat multiple groups of chips simultaneously, and greatly improvesthe production efficiency of the chips. A first mounting shaft and a second mounting shaft achieves the detachable installation of an auxiliary shaft, facilitates the replacement of coating wheels ofdifferent widths, satisfies the coating of different types and sizes of chips, achieves high flexibility and good universality. A stopping member achieves the axial positioning of the coating wheel,and prevents the displacement of the coating wheel during the coating process from affecting the coating operation.
Description
technical field [0001] The invention relates to the technical field of coating devices, in particular to a chip nano-silver paste coating device. Background technique [0002] The promotion of modern science and technology by nanotechnology has shown great results. In the field of semiconductor manufacturing, nanotechnology has allowed Moore's Law to continue. Material science experiments have proved that when the material particles reach the nanoscale, the material has high surface activity and surface performance. This makes the melting point or sintering temperature of nanoparticles much lower than that of bulk materials, but the materials formed after sintering have similar melting points and properties to bulk materials, which makes them have broad application prospects in the field of microsystem integration. . Silver metal is particularly suitable as an assembly material for high-power products, making nano-silver a popular packaging material among numerous nanomat...
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IPC IPC(8): H01L21/67
Inventor 崔建中
Owner HIDETAKA NANO TECH CO LTD