Heat dissipation module and optical module
A heat dissipation module and heat conduction block technology, which is applied in the field of optical modules, can solve the problems of low heat conduction efficiency of heat dissipation pads, achieve the effects of improving heat dissipation performance, overcoming heat dissipation capacity and circuit board space utilization, and good heat dissipation performance
Inactive Publication Date: 2019-06-28
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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Problems solved by technology
Due to the relatively low heat conduction efficiency of the heat dissipation pad, a large area is still required to reduce thermal resistance, which makes the large area required by the heat dissipation pad and the high density of components required by the circuit board an irreconcilable contradiction
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[0023] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
[0024] The terms used herein to denote relative spatial positions such as "upper", "above", "under", "under", etc. are for convenience of description to describe the relative position of one element or feature relative to another as shown in the drawings. Relationships of units or features. The terms of spatial relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would t...
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The present invention provides a heat dissipation module. The heat dissipation module comprises a housing, and heating elements, a circuit board and a heat dissipation piece which are arranged in thehousing, the heating elements are arranged on the circuit board, the circuit board is internally provided with heat conduction blocks corresponding to the heating elements, and the heat dissipation piece is connected between the heat conduction blocks and the housing; the heat generated by the heating elements reaches the housing by passing through the heat conduction blocks and the heat dissipation piece in order, wherein the heat dissipation piece comprises heat conduction columns and a heat conduction plate connected with the heat conduction columns, the superficial area of the heat conduction plate is larger than the sectional areas of the heat conduction columns, the heat conduction columns are in heat conduction connection with the heat conduction blocks, and the heat conduction plate is in heat conduction connection with the housing. The designed heat dissipation module employs the limited circuit board wiring space to obtain obviously improved heat dissipation performance so asto overcome the defect that a traditional heat dissipation module cannot take the consideration of the heat dissipation capacity and the circuit board space utilization rate.
Description
technical field [0001] The invention relates to a heat dissipation module and an optical module using the heat dissipation module. Background technique [0002] With the continuous development of optical communication technology, 400G optical modules have emerged and quickly become the industry benchmark. As the number of channels of the 400G optical module doubles, the rate of the optical module doubles, the modulation method becomes more and more complex, and the complexity of the overall circuit increases steadily. Compared with the previous 100G solution, the power consumption of the module is several times higher. However, the existing on-board heat dissipation solutions, whether it is the laser hole filling electroplating technology or the embedded heat dissipation block technology, all need to occupy a certain area on a certain printed circuit board (hereinafter referred to as the circuit board) for mounting the heat dissipation pad. It needs to occupy a large enough...
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IPC IPC(8): H05K7/20
Inventor 方习贵王克武陆滨纪以杨
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD