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Cutting and edge grinding integrated equipment

An integrated, equipment technology, applied in grinding/polishing equipment, machine tools suitable for grinding workpiece edges, glass manufacturing equipment, etc., can solve the problems of glass substrate damage, low efficiency of glass substrate cutting and grinding production lines, etc., to improve efficiency and good rate

Pending Publication Date: 2019-07-05
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, it is necessary to provide an integrated equipment with cutting and edging, so as to solve the problem that the existing glass substrate cutting and grinding production line has low efficiency and easily causes glass substrate damage

Method used

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  • Cutting and edge grinding integrated equipment
  • Cutting and edge grinding integrated equipment
  • Cutting and edge grinding integrated equipment

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Embodiment Construction

[0025] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0026] see figure 1 and figure 2 , this embodiment provides an integrated equipment with cutting and edging, including a carrier 10 , a grinding slide 20 , a grinding mechanism 30 , a gripper mechanism 40 and a frame 50 . The gripper mechanism is used to place the mother substrate of the glass substrate on the stage, and the daughter substrate of the polished glass substrate can also be transported and transported. Specifically, the gripper mechanism includes a vacuum chuck, a vacuum pump, and a mechanical arm. The vacuum chuck is connected to the vacuum pump tube through a pipeline, and then the vacuum pump is used to evacuate the vacuum chuck, and then the glass substrate is adsorbed and grasped. The pipes in the room are arrange...

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Abstract

The invention discloses cutting and edge grinding integrated equipment. A grinding slide table is mounted at the middle part of a frame; and a carrying table is mounted on the grinding slide table, and can perform plane movement on the grinding slide table. Grinding mechanisms are symmetrically mounted on the edge of the top surface of the frame; a transverse cutter wheel set is mounted on the frame between the grinding mechanisms and the carrying table; and a longitudinal cutter wheel set is perpendicular to the transverse cutter wheel set. The carrying table is provided with multiple stationareas; hollow grooves are formed in the middle parts of the station areas; power units and carrying plates are mounted in the hollow grooves; and a vacuum pump is used for vacuumizing multiple air holes in the carrying plates to absorb glass substrates on the carrying table. The glass substrates are cut through the longitudinal cutter wheel set and the transverse cutter wheel set; and after cutting, the carrying plates are hoisted by the power units, and the carrying table is shifted to contact the glass substrates with the grinding mechanisms for grinding, so that the cutting and grinding integration purpose is achieved, and the production efficiency and the yield are improved.

Description

technical field [0001] The invention relates to the field of glass equipment, in particular to an integrated equipment with cutting and edging. Background technique [0002] In the technical field of glass substrate production in display technology, it is necessary to cut the mother substrate of the glass substrate into smaller sub-substrates. The edges of the glass substrate cut into sub-substrates will have uneven surfaces and sharp edges. If the glass substrate is not ground, it will affect the subsequent process and may even cause the glass substrate to break. [0003] The existing traditional process requires two processes of processing by a cutting machine and a grinding machine, so the cut sub-substrate needs to be transported and calibrated and positioned at the grinding machine. During the conveying process of the sub-substrate, due to the unevenness of its edge, it will collide with the conveying track, which will easily cause damage to the sub-substrate, and even...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/10B24B41/06B24B47/20B24B49/12C03B33/03
CPCB24B9/10B24B41/06B24B47/20B24B49/12C03B33/03
Inventor 不公告发明人
Owner FUJIAN HUAJIACAI CO LTD
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