Fan-out packaging process for radio frequency chip

A technology of radio frequency chip and packaging technology, which is applied in the manufacture of electrical components, electrical solid state devices, semiconductor/solid state devices, etc. It can solve the problems of small auxiliary function chip area, troubles for designers, large area of ​​radio frequency chip, etc.

Active Publication Date: 2019-07-12
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the area of ​​the RF chip is large, and the area of ​​other auxiliary function chips is small. The direct stacking process can only use the process of pasting the functional chip on the RF chip, but the RF chip needs to receive and transmit signals on the surface, and the function chip may be too large. It will block the antenna of the RF chip, which will bring trouble to the designer

Method used

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  • Fan-out packaging process for radio frequency chip
  • Fan-out packaging process for radio frequency chip
  • Fan-out packaging process for radio frequency chip

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Embodiment Construction

[0031] The embodiments of the present invention are described in detail below, wherein the same or similar reference numerals represent the same or similar elements or elements with similar functions throughout. The following embodiments described with reference to the drawings are exemplary, and are only used to explain the present invention and cannot be used as a limitation to the present invention.

[0032] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and unless defined as here, idealized or overly formal meanings will not be used To explain.

[0033] The present invention will be f...

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Abstract

The invention discloses a fan-out packaging process for a radio frequency chip. The process comprises the steps of (101) load processing, (102) chip loading, (103) base processing, and (104) sealing.The present invention provides the fan-out packaging process for a radio frequency chip, and the problem that a stacked structure function chip blocks a radio frequency and affects signal reception and transmission is solved.

Description

Technical field [0001] The invention relates to the field of semiconductor technology, and more specifically, it relates to a fan-out packaging process for radio frequency chips. Background technique [0002] Millimeter wave radio frequency technology is developing rapidly in the semiconductor industry. It is widely used in high-speed data communications, automotive radar, airborne missile tracking systems, and space spectrum detection and imaging. It is expected that the market will reach 1.1 billion US dollars in 2018 and become an emerging industry. New applications put forward new requirements for the electrical performance, compact structure and system reliability of the product. For wireless transmitting and receiving systems, it is currently not integrated on the same chip (SOC), so it is necessary to include different chips including radio frequency units. , Filters, power amplifiers, etc. are integrated into an independent system to achieve the functions of transmitting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/60H01L23/538
CPCH01L21/4846H01L23/538H01L24/03H01L2224/18
Inventor 王永河冯光建马飞程明芳郭丽丽郑赞赞陈雪平郁发新
Owner 浙江集迈科微电子有限公司
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