Fan-out packaging process for radio frequency chip

Abstract

The invention discloses a fan-out packaging process for a radio frequency chip. The process comprises the steps of (101) load processing, (102) chip loading, (103) base processing, and (104) sealing.The present invention provides the fan-out packaging process for a radio frequency chip, and the problem that a stacked structure function chip blocks a radio frequency and affects signal reception and transmission is solved.

Description

Technical field [0001] The invention relates to the field of semiconductor technology, and more specifically, it relates to a fan-out packaging process for radio frequency chips. Background technique [0002] Millimeter wave radio frequency technology is developing rapidly in the semiconductor industry. It is widely used in high-speed data communications, automotive radar, airborne missile tracking systems, and space spectrum detection and imaging. It is expected that the market will reach 1.1 billion US dollars in 2018 and become an emerging industry. New applications put forward new requirements for the electrical performance, compact structure and system reliability of the product. For wireless transmitting and receiving systems, it is currently not integrated on the same chip (SOC), so it is necessary to include different chips including radio frequency units. , Filters, power amplifiers, etc. are integrated into an independent system to achieve the functions of transmitting ...

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Problems solved by technology

[0004] However, the area of ​​the RF chip is large, and the area of ​​other auxiliary function chips is small. The direct stacking process can only use the process of pasting the functional chip on the RF chip, but the RF chip needs to receive and transmit signals on the surface, and the function chip may be too large. It will block the antenna of the RF chip, which will bring trouble to the designer

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