A thermal radiation detector array and its manufacturing method

A detector array and heat radiation technology, applied in the field of sensors, can solve the problems of affecting the sensitivity of measurement and low metal absorption efficiency

Active Publication Date: 2021-04-13
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the low absorption efficiency of metals on thermal radiation, the planar metal interconnection area hardly absorbs thermal radiation, which makes the already extremely weak thermal radiation affect the sensitivity of the measurement

Method used

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  • A thermal radiation detector array and its manufacturing method
  • A thermal radiation detector array and its manufacturing method
  • A thermal radiation detector array and its manufacturing method

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Embodiment Construction

[0050] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] figure 1 It is a schematic structural diagram of a thermal radiation detector array according to an embodiment of the present invention, such as figure 1 As shown, the thermal radiation detector array includes several thermal radiation detector units, including:

[0052] For any thermal radiation detector unit, said any thermal radia...

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Abstract

An embodiment of the present invention provides a thermal radiation detector array and a manufacturing method thereof, including a first thermal radiation absorbing layer, a second thermal radiation absorbing layer, a temperature sensitive device, and a signal processing circuit layer. The planar metal interconnection connecting temperature-sensitive devices is located under the two thermal radiation absorbing layers, realizing the reflection and secondary absorption of the back-illuminated structure and transmitted thermal radiation, and significantly improving the thermal radiation absorption rate and detector performance. The metal conductor post with the splint structure fixes and supports the heat radiation absorbing layer, improving the stability and strength of the heat radiation absorbing layer. The invention solves the influence of metal interconnection on heat radiation absorption and the stability of the heat radiation absorbing layer, and realizes a heat radiation detector array with a three-layer structure with large heat absorption area, high reliability and fully integrated circuits.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of sensors, and in particular to a thermal radiation detector array and a manufacturing method thereof. Background technique [0002] The thermal radiation detector converts the thermal radiation temperature difference of the object into the temperature change of the temperature sensitive device, and then obtains the temperature radiation characteristics of the target object through the change of the physical or electrical parameters of the temperature sensitive device. [0003] When multiple thermal radiation detectors form an array, different units in the array can measure the temperature of different objects through an external optical system, thereby realizing thermal imaging of the target object. The noise of the device used in this heat measurement method is less affected by temperature, and generally does not need refrigeration during work, and can work directly at room temperatu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/20
CPCG01J5/20
Inventor 王喆垚
Owner TSINGHUA UNIV
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