A Method for Predicting the Performance of Lead Lap-Solder Interconnection Based on Electromagnetic Parameters of Physical Properties and Structure

Abstract

The invention discloses a method for predicting the performance of lead wire lap welding interconnection points based on physical property structure electromagnetic parameters, comprising: determining the physical property parameters and structural parameters of lead wire lap welding interconnection points; splitting the interconnection structure of lead wire lap welding interconnection points for impedance analysis ;Calculate the impedance of the coaxial line, determine the resistance, inductance, and capacitance values ​​to obtain the formula for calculating the impedance of the microstrip line; split the interconnection point into two parts according to the structure, and calculate the impedance of the equivalent microstrip line; deduce the lead wire The calculation formula of the overall reflection coefficient of the soldered interconnection point; quickly give the prediction performance of the overall transmission performance of the lead lap soldered interconnection point. The method of the invention can realize the coupling analysis of the basic parameters and transmission performance of the lead lap welding interconnection points, can be used to directly predict the signal transmission performance under the basic parameters of the interconnection points, and guide the structural design and optimization of the lead lap welding interconnection points.

Description

Technical field [0001] The present invention belongs to the field of microwave interconnection, and is specifically a lead-to-welding interopementary point performance prediction method based on a physical structure electromagnetic parameter. The new energy prediction method of signal transmission based on lead-off-welded interoperability structural electromagnetic parameters, which can be used to quickly accurately predict the operational state determined by the working state, and guide the parameter regulation of the lead pads. Background technique [0002] As the microwave assembly is used in large numbers of electronic equipment, a variety of interconnected points have been widely used in microwave assemblies in various radars, satellites, base stations and other fields. Among them, the lead-padded dots are easier to manufacture relative to other forms of interoperability, the volume is smaller, and the performance is better, so it is one of the most widely used interconnecti...

AI Technical Summary

Problems solved by technology

[0003] Although lead lap-welding interconnection points have been widely used in engineering, the current research at home and abroad is mainly carried out from two aspects. One is to study the reliability of lead-wire lap-welding interconnection points based on the physical and structural parameters of lead-wire lap-welding interconnection points and their working environment. Problems; one is the signal integrity problem caused by lead lap welding interconnection points in the circuit, mainly using software simulation tools to judge its performance, and judging its performance often takes a lot of time to establish interconnection point models and perform software simulations , and in the end it is often impossible to give specific regulatory guidance for reference

These problems are the biggest obstacles to improving the performance prediction and regulation efficiency of lead lap soldering interconnection points in engineering practice, and have limited the development of lead lap bonding interconnection points.

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