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Encapsulating LED lens with bottom reflectors

A technology of LED devices and lenses, which is applied in the field of packaging light-emitting diodes (LEDs), and can solve problems such as light waste

Active Publication Date: 2019-08-02
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this light may also be wasted

Method used

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  • Encapsulating LED lens with bottom reflectors
  • Encapsulating LED lens with bottom reflectors
  • Encapsulating LED lens with bottom reflectors

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Experimental program
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Embodiment Construction

[0023] figure 1 A substrate wafer 10 populated with an array of LED dies 12 is shown. In another embodiment, only a single LED die 12 is processed at a time. LED die 12 may be of any type, including flip chip, vertical, wire bonded, and the like. In a simplified example, only twelve LED dies 12 are shown, but in practical embodiments, hundreds of LED dies 12 would typically be mounted on a single substrate wafer 10 . The LED die 12 is typically about 1 mm on each side. Substrate wafer 10 may be conventional, such as a ceramic wafer with conductive traces, or may be formed from another material. Wafer 10 may also be rectangular, hexagonal, or any other suitable shape.

[0024] figure 2 is a cross-sectional view of a pre-formed lens 14 in accordance with one embodiment of the invention. image 3 is a bottom-up view of lens 14 illustrating the vertices of facets 18 and 22 and the outline of LED die cavity 16 . Figure 4 Lens 14 mounted over LED die 12 is shown. Lens 14 m...

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PUM

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Abstract

A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens hasa cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.

Description

technical field [0001] The present invention relates to packaging light emitting diodes (LEDs), and in particular to packaging LED dies with lenses having bottom reflective characteristics. Background technique [0002] It is common to mount the LED die on a substrate (substrate) and position a pre-formed dome lens over the LED die to package it. The dome lens has a cavity for the LED die, which contains transparent or translucent elastic silicone. The bottom of the lens is otherwise flat. When the domed lens is pressed over the LED die, the silicone fills the void around the LED die. [0003] With such a structure, the light emission is generally Lambertian. Light emitted from the side of the LED die or at shallow angles is often wasted light because useful light emissions are generally light emitted in the forward direction. Such packaged LED dies have been mounted in small reflective conical cups to direct all light in the forward direction, but such cups add cost and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/58H01L33/60
CPCH01L33/54H01L33/60H01L2224/13H01L33/58
Inventor W.达伊施纳F.S.戴安娜M.马拉A.S.哈奎M.M.布特沃思
Owner LUMILEDS HLDG BV